XC4VFX40-11FFG672C

IC FPGA 352 I/O 672FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 352 2654208 41904 672-BBGA, FCBGA

Quantity 783 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGA, FCBGANumber of I/O352Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4656Number of Logic Elements/Cells41904
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2654208

Overview of XC4VFX40-11FFG672C – Virtex®-4 FX FPGA, 672-FCBGA (27×27)

The XC4VFX40-11FFG672C is a Virtex®-4 FX Field Programmable Gate Array (FPGA) IC from AMD. This commercial-grade, surface-mount FPGA provides a substantial logic fabric, embedded memory, and plentiful I/O for programmable digital designs.

With approximately 41,904 logic elements, about 2.65 Mbits of on-chip RAM and up to 352 I/O pins, the device is targeted at designs that require high logic density, embedded memory resources, and extensive external interfacing within a 672-FCBGA (27×27) package.

Key Features

  • Logic Capacity — Approximately 41,904 logic elements, enabling complex programmable logic implementations.
  • Embedded Memory — Approximately 2.65 Mbits of on-chip RAM for data buffering, local storage, and state machine implementation.
  • I/O Count — Up to 352 user I/O pins to support wide parallel interfaces and multiple external peripherals.
  • Power Supply — Operates from a core voltage range of 1.14 V to 1.26 V.
  • Package & Mounting — 672-BBGA / 672-FCBGA (27×27) package, surface-mount for compact board-level integration.
  • Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • High-density logic designs — Implements complex custom logic and state machines using the device's large logic element count.
  • Embedded memory-centric functions — Utilizes approximately 2.65 Mbits of on-chip RAM for buffering, lookup tables, or local data storage.
  • I/O-intensive interfacing — Connects to multiple external devices and wide buses using up to 352 I/O pins.

Unique Advantages

  • High logic integration: Approximately 41,904 logic elements reduce the need for multiple discrete logic devices in a design.
  • Sizable on-chip memory: Roughly 2.65 Mbits of embedded RAM supports local buffering and memory-intensive tasks without external memory for some functions.
  • Extensive external connectivity: Up to 352 I/O pins enable broad interfacing options for peripherals, sensors, and parallel data paths.
  • Compact, board-ready package: 672-FCBGA (27×27) surface-mount package offers a high-density solution for space-constrained PCBs.
  • Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial applications and environments.
  • RoHS compliant: Conforms to environmental compliance requirements for lead-free manufacturing.

Why Choose XC4VFX40-11FFG672C?

The XC4VFX40-11FFG672C balances substantial programmable logic capacity, embedded memory resources, and a high I/O count within a compact 672-FCBGA package. Its commercial-grade temperature range and RoHS compliance make it suitable for standard embedded and board-level applications that demand dense logic and on-chip memory.

Designed as part of the Virtex®-4 FX family from AMD, this FPGA is an option for engineers seeking a high-density, surface-mount programmable device that supports complex logic implementations and extensive interfacing on a single chip.

Request a quote or submit an inquiry to purchase XC4VFX40-11FFG672C and discuss availability and pricing with the supplier.

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