XC4VFX40-10FFG672I

IC FPGA 352 I/O 672FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 352 2654208 41904 672-BBGA, FCBGA

Quantity 1,045 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O352Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4656Number of Logic Elements/Cells41904
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2654208

Overview of XC4VFX40-10FFG672I – Virtex®-4 FX Field Programmable Gate Array (FPGA), 672-FCBGA (27×27), Industrial

The XC4VFX40-10FFG672I is an industrial-grade Virtex®-4 FX FPGA from AMD, delivered in a 672-ball FCBGA (27×27) package for high-density board designs. It combines a substantial logic fabric with embedded memory and a large I/O count to address complex, I/O‑heavy digital designs.

With 4,656 CLBs, 41,904 logic elements and approximately 2.65 Mbits of on-chip RAM, this device is suited for applications that require integration of large custom logic, significant embedded memory, and broad external interfacing while operating across a −40 °C to 100 °C range.

Key Features

  • Core Logic  4,656 CLBs and 41,904 logic elements provide the programmable fabric for implementing complex digital functions and custom processing pipelines.
  • Embedded Memory  Approximately 2.65 Mbits of on-chip RAM to support buffering, lookup tables, and embedded data storage without external memory for many functions.
  • I/O Capacity  352 I/O pins enable connectivity to multiple peripherals, sensors, and high-density external interfaces.
  • Power  Specified voltage supply range of 1.14 V to 1.26 V to match low-voltage system domains and simplify power planning.
  • Package & Mounting  672-BBGA FCBGA package (27×27) in a surface-mount form factor for compact, high-density PCB implementations.
  • Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Compliance  RoHS compliant for adherence to common environmental and manufacturing requirements.

Typical Applications

  • Industrial Control Systems  Use the device’s industrial temperature range and large logic capacity to implement deterministic control, protocol handling, and sensor aggregation in factory and process automation.
  • Embedded Processing  Leverage the combination of CLBs and on-chip RAM for custom data paths, preprocessing, and hardware-accelerated functions in embedded platforms.
  • High‑Density I/O Systems  Take advantage of 352 I/O pins to interface with multiple ADCs/DACs, transceivers, or parallel buses for complex signal routing and I/O-heavy applications.
  • Prototyping and Custom Logic  Large logic element count supports development of complex algorithms and system prototypes that require reprogrammable logic and memory resources.

Unique Advantages

  • Highly integrated logic fabric: 4,656 CLBs and 41,904 logic elements reduce the need for multiple discrete logic devices, simplifying board-level design.
  • Substantial on-chip memory: Approximately 2.65 Mbits of embedded RAM supports buffering and local data storage to improve throughput and reduce external memory dependence.
  • Broad external interfacing: 352 I/O pins enable flexible connectivity to sensors, peripherals, and custom interfaces without extensive multiplexing.
  • Industrial robustness: Rated for −40 °C to 100 °C operation and supplied in an industrial grade package for reliable performance in harsh environments.
  • Compact, high-density package: 672-BBGA FCBGA (27×27) supports dense routing and space-constrained board layouts while maintaining high pin count.
  • Low-voltage operation: Narrow voltage supply range (1.14 V–1.26 V) helps align the FPGA with modern low-voltage power domains.

Why Choose XC4VFX40-10FFG672I?

The XC4VFX40-10FFG672I positions itself as a versatile, industrial-grade FPGA that balances substantial programmable logic, on-chip memory and high I/O capacity in a compact FCBGA package. It is appropriate for engineers and designers building embedded systems, industrial automation equipment, and I/O-intensive applications that require reliable operation across a wide temperature range.

Choosing this Virtex‑4 FX device provides a scalable hardware platform for complex digital designs, enabling consolidation of functions into a single programmable device and supporting long-term design flexibility.

Request a quote or submit a pricing inquiry to check availability and obtain procurement details for the XC4VFX40-10FFG672I.

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