XC4VFX60-10FF1152C

The XC4VFX60-10FF1152C is a Virtex-4 FX field programmable gate array (FPGA) from AMD designed for high-capacity logic and dense I/O integration. With 6,320 CLBs (56,880 logic cells), approximately 4.28 Mbits of embedded memory, and 576 I/O pins in a 1152‑FCBGA package, it targets designs that require substantial on-chip logic, memory, and interface density while operating within commercial temperature ranges.

Key Features

• Core Logic Capacity  6,320 CLBs providing 56,880 logic cells to implement complex combinational and sequential logic functions.
• Embedded Memory  Approximately 4.28 Mbits of on-chip RAM for data buffering, state storage, and memory-mapped logic.
• High-Density I/O  576 I/O pins enable extensive external interfacing and high pin-count connectivity options.
• Power Supply Range  Operates from 1.14 V to 1.26 V to match system power rails and design constraints.
• Package and Mounting  1152‑FCBGA (35 × 35) package in a surface-mount form factor supporting compact, board-level integration.
• Operating Grade  Commercial-grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant to meet common lead-free manufacturing requirements.

Typical Applications

• Logic-intensive embedded systems  Use the device’s 6,320 CLBs and 56,880 logic cells to implement complex hardware functions and custom processing pipelines.
• High-density I/O interfacing  The 576 I/O pins support designs that require multiple external interfaces, sensors, or parallel data streams.
• Memory-dependent processing  Approximately 4.28 Mbits of embedded memory suits buffering, FIFOs, and state storage within on-chip logic.
• Compact board-level integration  The 1152‑FCBGA surface-mount package enables high-density placement in space-constrained systems.

Unique Advantages

• High logic density: 6,320 CLBs and 56,880 logic cells allow large designs to be consolidated on a single FPGA, reducing external component count.
• Ample on-chip memory: Approximately 4.28 Mbits of embedded RAM minimizes the need for external memory for many buffering and state-storage tasks.
• Extensive I/O availability: 576 I/O pins provide flexibility for interfacing multiple peripherals, sensors, and high-speed data lines.
• Compact FCBGA packaging: 1152‑FCBGA (35×35) supports dense PCB layouts and reliable surface-mount assembly.
• Commercial-temperature operation: Specified 0 °C to 85 °C rating supports a wide range of non-industrial applications.
• RoHS compliant: Meets common environmental and manufacturing regulations for lead-free assembly.

Why Choose XC4VFX60-10FF1152C?

The XC4VFX60-10FF1152C combines substantial logic and memory resources with a high I/O count in a compact FCBGA package, making it suitable for designs that need integrated processing, buffering, and extensive external connectivity within commercial operating conditions. As a Virtex-4 FX device from AMD, it provides a clear specification set for engineers evaluating capacity, power envelope, and package constraints.

Choose this FPGA when your design requires a balance of large on-chip logic capacity, meaningful embedded memory, and high pin-count interfacing in a surface-mount FCBGA form factor for commercial-temperature applications.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the XC4VFX60-10FF1152C.