XC4VFX60-10FF1152I
| Part Description |
Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 576 4276224 56880 1152-BBGA, FCBGA |
|---|---|
| Quantity | 955 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 576 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 6320 | Number of Logic Elements/Cells | 56880 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4276224 |
Overview of XC4VFX60-10FF1152I – Virtex®-4 FX FPGA, 56,880 logic elements, 1152-FCBGA
The XC4VFX60-10FF1152I is a Virtex-4 FX Field Programmable Gate Array (FPGA) manufactured by AMD. It combines a high count of logic resources with substantial on-chip memory and a large I/O complement, packaged in a 1152-FCBGA surface-mount form factor for industrial applications.
This device targets designs that require dense programmable logic, extensive embedded memory, and high pin-count interfacing while operating across an industrial temperature range and a defined core voltage window.
Key Features
- Core Logic 56,880 logic elements provide a substantial programmable fabric for implementing complex custom logic and control functions.
- Embedded Memory Approximately 4.3 Mbits of on-chip RAM (4,276,224 bits) for buffering, state storage, and local data processing.
- I/O Density 576 user I/O pins support high connectivity for parallel interfaces, board-level routing, and dense system integration.
- Power Supply Specified core voltage range of 1.14 V to 1.26 V to match required power rails and system power design.
- Package & Mounting 1152-FCBGA (35 × 35 mm) package in a 1152-BBGA/FCBGA form factor, designed for surface-mount PCB assembly.
- Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
- Regulatory Status RoHS compliant for environmental requirements in electronics manufacturing.
Typical Applications
- Industrial Automation Implement custom control logic, motor sequencing, and I/O aggregation in factory equipment and PLCs.
- Communications Equipment Use the device for protocol processing, packet handling, and high-density interface bridging in networking hardware.
- Embedded Systems & Prototyping Rapidly prototype and validate complex hardware functions where significant logic and memory resources are required.
- High-Density I/O Systems Support board-level designs that require many parallel or high-pin-count connections to sensors, ADCs/DACs, or backplane interfaces.
Unique Advantages
- High Logic Capacity: 56,880 logic elements enable integration of substantial functionality on a single device, reducing the need for multiple FPGAs.
- Significant On-Chip Memory: Approximately 4.3 Mbits of embedded RAM supports local buffering and stateful processing without relying on external memory.
- Large I/O Complement: 576 I/O pins give designers flexibility for complex interfacing and high connector-count applications.
- Industrial Temperature Range: Rated for −40 °C to 100 °C operation, suitable for systems deployed in demanding environments.
- Compact, Surface-Mount Package: The 1152-FCBGA (35 × 35 mm) package allows high-density PCB layouts while maintaining robust board-level mounting.
- Regulatory Compliance: RoHS compliance assists in meeting environmental requirements for manufactured electronics.
Why Choose XC4VFX60-10FF1152I?
The XC4VFX60-10FF1152I positions itself as a high-capacity programmable platform for industrial-grade designs that require a balance of logic density, embedded memory, and extensive I/O. Its specified core voltage range and surface-mount 1152-FCBGA package make it suitable for integration into compact, high-performance boards.
Engineers developing control systems, communications equipment, or complex embedded prototypes will find the combination of 56,880 logic elements, approximately 4.3 Mbits of on-chip RAM, and 576 I/O pins useful for consolidating system functions and simplifying board-level design while adhering to industrial operating temperature requirements.
Request a quote or submit an order inquiry to check availability and pricing for the XC4VFX60-10FF1152I. Our team can provide lead-time and procurement options to support your design schedule.

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