XC4VFX60-10FF1152I

IC FPGA 576 I/O 1152FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 576 4276224 56880 1152-BBGA, FCBGA

Quantity 955 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O576Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6320Number of Logic Elements/Cells56880
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4276224

Overview of XC4VFX60-10FF1152I – Virtex®-4 FX FPGA, 56,880 logic elements, 1152-FCBGA

The XC4VFX60-10FF1152I is a Virtex-4 FX Field Programmable Gate Array (FPGA) manufactured by AMD. It combines a high count of logic resources with substantial on-chip memory and a large I/O complement, packaged in a 1152-FCBGA surface-mount form factor for industrial applications.

This device targets designs that require dense programmable logic, extensive embedded memory, and high pin-count interfacing while operating across an industrial temperature range and a defined core voltage window.

Key Features

  • Core Logic 56,880 logic elements provide a substantial programmable fabric for implementing complex custom logic and control functions.
  • Embedded Memory Approximately 4.3 Mbits of on-chip RAM (4,276,224 bits) for buffering, state storage, and local data processing.
  • I/O Density 576 user I/O pins support high connectivity for parallel interfaces, board-level routing, and dense system integration.
  • Power Supply Specified core voltage range of 1.14 V to 1.26 V to match required power rails and system power design.
  • Package & Mounting 1152-FCBGA (35 × 35 mm) package in a 1152-BBGA/FCBGA form factor, designed for surface-mount PCB assembly.
  • Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Regulatory Status RoHS compliant for environmental requirements in electronics manufacturing.

Typical Applications

  • Industrial Automation Implement custom control logic, motor sequencing, and I/O aggregation in factory equipment and PLCs.
  • Communications Equipment Use the device for protocol processing, packet handling, and high-density interface bridging in networking hardware.
  • Embedded Systems & Prototyping Rapidly prototype and validate complex hardware functions where significant logic and memory resources are required.
  • High-Density I/O Systems Support board-level designs that require many parallel or high-pin-count connections to sensors, ADCs/DACs, or backplane interfaces.

Unique Advantages

  • High Logic Capacity: 56,880 logic elements enable integration of substantial functionality on a single device, reducing the need for multiple FPGAs.
  • Significant On-Chip Memory: Approximately 4.3 Mbits of embedded RAM supports local buffering and stateful processing without relying on external memory.
  • Large I/O Complement: 576 I/O pins give designers flexibility for complex interfacing and high connector-count applications.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C operation, suitable for systems deployed in demanding environments.
  • Compact, Surface-Mount Package: The 1152-FCBGA (35 × 35 mm) package allows high-density PCB layouts while maintaining robust board-level mounting.
  • Regulatory Compliance: RoHS compliance assists in meeting environmental requirements for manufactured electronics.

Why Choose XC4VFX60-10FF1152I?

The XC4VFX60-10FF1152I positions itself as a high-capacity programmable platform for industrial-grade designs that require a balance of logic density, embedded memory, and extensive I/O. Its specified core voltage range and surface-mount 1152-FCBGA package make it suitable for integration into compact, high-performance boards.

Engineers developing control systems, communications equipment, or complex embedded prototypes will find the combination of 56,880 logic elements, approximately 4.3 Mbits of on-chip RAM, and 576 I/O pins useful for consolidating system functions and simplifying board-level design while adhering to industrial operating temperature requirements.

Request a quote or submit an order inquiry to check availability and pricing for the XC4VFX60-10FF1152I. Our team can provide lead-time and procurement options to support your design schedule.

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