XC4VFX60-10FFG1152I

The XC4VFX60-10FFG1152I is a Virtex®-4 FX field programmable gate array (FPGA) from AMD, supplied in a 1152-ball FCBGA package. It provides a balanced combination of on-chip logic, embedded memory, and I/O density for industrial applications that require flexible, reconfigurable hardware.

This device is suited for designs that need significant programmable logic capacity—with 56,880 logic elements—alongside substantial embedded memory and a large I/O count, enabling integration of multiple functions into a single FPGA footprint.

Key Features

• Programmable Logic — 56,880 logic elements (cells) to implement complex custom logic and control functions.
• Embedded Memory — Approximately 4.3 Mbits of on-chip RAM (4,276,224 bits) for data buffering, FIFOs, and on-chip storage.
• I/O Density — 576 user I/O pins to support multiple parallel interfaces and board-level connectivity.
• Package — 1152-FCBGA (35×35) surface-mount package (1152-BBGA, FCBGA) for high-density board designs.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power design requirements.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• RoHS Compliant — Conforms to RoHS requirements for material compliance.

Typical Applications

• Industrial Control — Implement motor control, signal conditioning, and sequence logic using the device’s large logic and I/O resources.
• Communications Equipment — Use the extensive I/O and embedded memory for protocol handling, data framing, and buffer management.
• Imaging and Signal Processing — Leverage on-chip memory and abundant logic elements for real-time data path processing and temporary storage.

Unique Advantages

• Significant Logic Capacity: 56,880 logic elements provide room for complex designs and integration of multiple subsystems on a single device.
• Substantial On-Chip Memory: Approximately 4.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching tasks.
• High I/O Count: 576 I/O pins enable direct interfacing to numerous peripherals and parallel buses without additional interface chips.
• Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in thermally challenging environments.
• Compact, High-Density Package: 1152-FCBGA (35×35) surface-mount package supports high-density PCB layouts while delivering robust connectivity.
• Material Compliance: RoHS compliance addresses regulatory material requirements in many markets.

Why Choose XC4VFX60-10FFG1152I?

The XC4VFX60-10FFG1152I positions itself as a versatile FPGA option for industrial and high-density applications that require a combination of extensive programmable logic, embedded memory, and large I/O capacity. Its package and operating temperature range make it suitable for compact, board-level implementations in environments with wide temperature variation.

Designers targeting systems that consolidate multiple functions into a single programmable device will find this part well suited for scalable prototypes and production designs that benefit from a robust logic/memory balance and ample I/O availability.

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