XC4VFX60-10FFG672I

IC FPGA 352 I/O 672FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 352 4276224 56880 672-BBGA, FCBGA

Quantity 1,305 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O352Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6320Number of Logic Elements/Cells56880
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4276224

Overview of XC4VFX60-10FFG672I – Virtex®-4 FX Field Programmable Gate Array, 672‑FCBGA

The XC4VFX60-10FFG672I is a Virtex®-4 FX field programmable gate array (FPGA) from AMD, offered in a 672‑ball FCBGA package. It provides a balance of programmable logic capacity, on-chip memory, and flexible I/O in an industrial-grade surface-mount package.

This device is well suited for designs that require substantial logic resources and embedded memory while operating across an industrial temperature range and within a 1.14 V to 1.26 V core supply window.

Key Features

  • Core Logic  6,320 configurable logic blocks (CLBs) delivering 56,880 logic elements for implementing complex digital functions.
  • Embedded Memory  Approximately 4.28 Mbits of on-chip RAM to support frame buffers, FIFOs, and other data storage needs.
  • I/O Capability  352 user I/O pins to interface with external peripherals and high-pin-count systems.
  • Package  672‑BBGA (FCBGA) supplier device package, 27 × 27 mm footprint for high-density board designs.
  • Power  Core supply operating range from 1.14 V to 1.26 V to match target power architectures.
  • Thermal and Mechanical  Industrial operating temperature range of −40 °C to 100 °C and surface-mount assembly compatibility.
  • Environmental Compliance  RoHS compliant for regulatory and manufacturing process consistency.

Unique Advantages

  • High logic density: The combination of 6,320 CLBs and 56,880 logic elements supports implementation of large-scale, custom digital designs without external logic expansion.
  • Substantial embedded memory: Approximately 4.28 Mbits of on-chip RAM reduces dependence on external memory for many buffering and temporary storage tasks.
  • Generous I/O count: 352 user I/Os enable direct interfacing to multiple peripherals, sensors, and high-speed I/O banks.
  • Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
  • Compact high‑pin package: 672‑ball FCBGA (27 × 27 mm) provides a high pin density in a board-efficient footprint.
  • Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and product deployment.

Why Choose XC4VFX60-10FFG672I?

The XC4VFX60-10FFG672I positions itself as an industrial-grade FPGA option combining substantial programmable logic, embedded memory, and a high I/O count in a compact 672‑FCBGA package. Its operating voltage range and temperature rating make it suitable for designs that require reliable operation across a broad set of environmental conditions.

This device is appropriate for engineering teams and procurement groups looking for a scalable, integrated programmable platform with clear, verifiable specifications for logic capacity, memory, I/O, and packaging.

Request a quote or submit an inquiry today to get pricing and availability information for the XC4VFX60-10FFG672I.

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