XC4VFX60-10FFG672I
| Part Description |
Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 352 4276224 56880 672-BBGA, FCBGA |
|---|---|
| Quantity | 1,305 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 352 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 6320 | Number of Logic Elements/Cells | 56880 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4276224 |
Overview of XC4VFX60-10FFG672I – Virtex®-4 FX Field Programmable Gate Array, 672‑FCBGA
The XC4VFX60-10FFG672I is a Virtex®-4 FX field programmable gate array (FPGA) from AMD, offered in a 672‑ball FCBGA package. It provides a balance of programmable logic capacity, on-chip memory, and flexible I/O in an industrial-grade surface-mount package.
This device is well suited for designs that require substantial logic resources and embedded memory while operating across an industrial temperature range and within a 1.14 V to 1.26 V core supply window.
Key Features
- Core Logic 6,320 configurable logic blocks (CLBs) delivering 56,880 logic elements for implementing complex digital functions.
- Embedded Memory Approximately 4.28 Mbits of on-chip RAM to support frame buffers, FIFOs, and other data storage needs.
- I/O Capability 352 user I/O pins to interface with external peripherals and high-pin-count systems.
- Package 672‑BBGA (FCBGA) supplier device package, 27 × 27 mm footprint for high-density board designs.
- Power Core supply operating range from 1.14 V to 1.26 V to match target power architectures.
- Thermal and Mechanical Industrial operating temperature range of −40 °C to 100 °C and surface-mount assembly compatibility.
- Environmental Compliance RoHS compliant for regulatory and manufacturing process consistency.
Unique Advantages
- High logic density: The combination of 6,320 CLBs and 56,880 logic elements supports implementation of large-scale, custom digital designs without external logic expansion.
- Substantial embedded memory: Approximately 4.28 Mbits of on-chip RAM reduces dependence on external memory for many buffering and temporary storage tasks.
- Generous I/O count: 352 user I/Os enable direct interfacing to multiple peripherals, sensors, and high-speed I/O banks.
- Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
- Compact high‑pin package: 672‑ball FCBGA (27 × 27 mm) provides a high pin density in a board-efficient footprint.
- Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and product deployment.
Why Choose XC4VFX60-10FFG672I?
The XC4VFX60-10FFG672I positions itself as an industrial-grade FPGA option combining substantial programmable logic, embedded memory, and a high I/O count in a compact 672‑FCBGA package. Its operating voltage range and temperature rating make it suitable for designs that require reliable operation across a broad set of environmental conditions.
This device is appropriate for engineering teams and procurement groups looking for a scalable, integrated programmable platform with clear, verifiable specifications for logic capacity, memory, I/O, and packaging.
Request a quote or submit an inquiry today to get pricing and availability information for the XC4VFX60-10FFG672I.

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