XC4VFX60-10FF672I

The XC4VFX60-10FF672I is a Virtex®-4 FX field programmable gate array (FPGA) in a 672‑ball FCBGA package. It combines high logic capacity, embedded memory, and abundant I/O in an industrial-grade, surface-mount device.

Key on-chip resources include 56,880 logic elements, approximately 4.28 Mbits of embedded memory, and 352 user I/O pins. The device operates from 1.14 V to 1.26 V and supports an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Capacity  56,880 logic elements and 6,320 CLBs provide substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 4.28 Mbits of on‑chip RAM for buffering, state storage, and memory‑centric logic functions.
• I/O Resources  352 user I/O pins to support high-density interfacing and multiple peripheral connections.
• Power  Nominal supply voltage range of 1.14 V to 1.26 V for core operation.
• Package & Mounting  672‑FCBGA (27×27) package in a surface‑mount form factor for compact board-level integration.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in temperature‑varying environments.
• Compliance  RoHS compliant, meeting common regulatory environmental requirements.

Typical Applications

• Industrial Control & Automation  Use the device’s industrial temperature rating and dense logic to implement motor control, PLC functions, and industrial protocol handling.
• Custom Digital Systems  Implement bespoke digital logic, finite state machines, and hardware accelerators that leverage large logic and memory resources.
• High‑Density I/O Interfacing  Bridge multiple peripherals and buses or aggregate sensors and actuators using the 352 available I/O pins.
• Memory‑Centric Designs  Leverage approximately 4.28 Mbits of embedded RAM for buffering, packet processing, and data staging in real‑time pipelines.

Unique Advantages

• High logic capacity: 56,880 logic elements enable implementation of large, complex logic designs without immediate upscaling.
• Substantial on‑chip RAM: Approximately 4.28 Mbits of embedded memory reduces external memory dependency and simplifies board design.
• Extensive I/O count: 352 user I/O pins support rich connectivity and multi‑interface deployments.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Compact FCBGA package: 672‑ball FCBGA (27×27) enables a high‑density board footprint for space‑constrained systems.
• Regulatory readiness: RoHS compliance supports environmentally conscious product designs.

Why Choose XC4VFX60-10FF672I?

The XC4VFX60-10FF672I provides a balanced combination of programmable logic density, embedded memory, and abundant I/O in a robust industrial package. Its voltage and temperature specifications make it suitable for production systems that require predictable electrical and thermal behavior.

This device is well suited to engineers and procurement teams designing industrial control, high‑density I/O interfaces, or custom digital processing solutions that benefit from integrated memory and sizable logic capacity. Manufacturer documentation is available to support integration and validation efforts.

Request a quote or submit an inquiry to obtain pricing and availability for the XC4VFX60-10FF672I.