XC4VFX60-10FF672C

IC FPGA 352 I/O 672FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 352 4276224 56880 672-BBGA, FCBGA

Quantity 1,479 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGA, FCBGANumber of I/O352Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6320Number of Logic Elements/Cells56880
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4276224

Overview of XC4VFX60-10FF672C – Virtex®-4 FX Field Programmable Gate Array, 672-FCBGA (27×27)

The XC4VFX60-10FF672C is a Virtex®-4 FX field programmable gate array (FPGA) in a 672-ball FCBGA package designed for commercial-grade embedded logic applications. It integrates 56,880 logic elements and approximately 4.28 Mbits of on-chip RAM, alongside 352 user I/O pins, enabling complex custom logic, buffering and interfacing in a single device.

With a 1.14 V to 1.26 V core voltage range, surface-mount 672-FCBGA (27×27) package, and a 0 °C to 85 °C operating range, this FPGA is targeted at designs that require high-density programmability with defined commercial-temperature operation and RoHS compliance.

Key Features

  • Core Logic  56,880 logic elements provide programmable resources for implementing custom digital functions, state machines, and data-paths.
  • Embedded Memory  Approximately 4.28 Mbits of on-chip RAM for FIFOs, buffers, and local data storage to support high-throughput logic designs.
  • I/O Density  352 user I/O pins for broad system interfacing, enabling multiple parallel data channels and flexible signal routing.
  • Power Supply  Core voltage supply range of 1.14 V to 1.26 V to match platform power budgeting and regulator designs.
  • Package & Mounting  672-ball FCBGA (27×27) surface-mount package for compact board-level integration and high pin-count density.
  • Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operation, suitable for a wide range of commercial embedded systems.
  • Environmental Compliance  RoHS compliant, supporting lead-free assembly and regulatory requirements for many commercial products.

Typical Applications

  • Data and signal processing systems  Use the 56,880 logic elements and on-chip RAM to implement custom data-paths, packet processing, and buffering functions.
  • Embedded control and interfacing  Leverage 352 I/O pins for connecting sensors, peripherals, and external devices while consolidating glue logic into the FPGA fabric.
  • Custom protocol bridging  Deploy programmable logic to implement protocol translators, timing adaptation, and bespoke serial/parallel interfaces within a single device.
  • Prototyping and system integration  High logic density and embedded memory make the device useful for developing and validating complex hardware algorithms and system prototypes.

Unique Advantages

  • High-density programmable logic: 56,880 logic elements enable integration of sizable custom functions and hardware accelerators without multiple discrete components.
  • On-chip memory resources: Approximately 4.28 Mbits of embedded RAM reduce external memory dependency for buffering and temporary storage, simplifying board design.
  • Extensive I/O count: 352 user I/O pins provide flexibility for multi-channel interfaces and parallel data paths, minimizing external interface components.
  • Compact package: 672-FCBGA (27×27) offers a high pin-count solution in a compact footprint for space-constrained PCB layouts.
  • Commercial suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for deployment in commercial embedded products.

Why Choose XC4VFX60-10FF672C?

The XC4VFX60-10FF672C positions itself as a high-density, commercially-graded Virtex-4 FX FPGA option providing a balanced combination of programmable logic, embedded memory, and I/O resources in a 672-ball FCBGA package. Its specification set—56,880 logic elements, approximately 4.28 Mbits of on-chip RAM, 352 I/Os, and a defined core voltage range—makes it suitable for engineers building complex digital systems that require substantial on-chip resources and flexible interfacing.

For designers focused on integrating substantial custom logic and buffering within a single, RoHS-compliant device footprint, this FPGA offers a clear hardware platform to consolidate functions, reduce component count, and accelerate system-level development.

Request a quote or submit an inquiry to receive pricing and availability information for the XC4VFX60-10FF672C and to discuss how it can meet your design requirements.

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