XC4VFX60-10FFG1152C

The XC4VFX60-10FFG1152C is a Virtex®-4 FX Field Programmable Gate Array (FPGA) offered in a 1152-ball FCBGA package. It provides a high logic density platform with substantial on-chip memory and a large I/O complement for commercial electronic applications requiring flexible, reconfigurable logic.

Key Features

• Core Logic – 56,880 logic elements to implement complex digital logic and custom processing functions.
• Configurable Logic Blocks – Logic resources sized to support multi-function designs and parallel processing workloads.
• Embedded Memory – Approximately 4.28 Mbits (4,276,224 bits) of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Capacity – 576 I/O pins to support dense interfacing with external devices and boards.
• Package & Mounting – 1152-FCBGA (35×35) package, surface-mount mounting type for compact board-level integration.
• Power – Specified supply voltage range of 1.14 V to 1.26 V for the core domain.
• Temperature & Grade – Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance – RoHS compliant, supporting lead-free assembly processes.

Typical Applications

• High-density I/O systems – Use where large numbers of external interfaces are required; 576 I/Os enable complex peripheral and bus connectivity.
• Logic-intensive custom processing – Implement custom datapaths and control logic leveraging 56,880 logic elements.
• On-chip buffering and storage – Designs that require embedded memory for packet buffering, FIFOs, or small datasets benefit from ~4.28 Mbits of RAM.
• Compact board-level integration – Surface-mount FCBGA package (1152 balls, 35×35) suited for space-constrained commercial equipment.

Unique Advantages

• High logic capacity: 56,880 logic elements provide the resources to consolidate multiple functions into a single device, reducing system complexity.
• Substantial on-chip memory: Approximately 4.28 Mbits of embedded RAM supports local data handling and reduces external memory dependence.
• Extensive I/O: 576 I/O pins enable broad interfacing options and high pin-count peripheral support.
• Compact FCBGA packaging: 1152-ball, 35×35 FCBGA allows dense placement on PCBs while keeping a surface-mount footprint.
• Commercial temperature suitability: Rated 0 °C to 85 °C for deployments in standard commercial environments.
• RoHS compliant: Conforms to lead-free manufacturing requirements for environmentally conscious production.

Why Choose XC4VFX60-10FFG1152C?

The XC4VFX60-10FFG1152C combines a large pool of logic elements, significant on-chip RAM, and a high I/O count in a compact FCBGA package, making it well suited for commercial designs that demand integration of complex logic and dense connectivity. Its defined core voltage range and commercial operating temperature make it appropriate for production systems and prototypes targeting standard commercial environments.

This device is ideal for engineering teams working on resource-intensive FPGA designs that need scalable logic resources, embedded memory for local data handling, and a package compatible with surface-mount assembly processes.

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