XC4VFX60-11FF1152I

IC FPGA 576 I/O 1152FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 576 4276224 56880 1152-BBGA, FCBGA

Quantity 1,427 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O576Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6320Number of Logic Elements/Cells56880
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4276224

Overview of XC4VFX60-11FF1152I – Virtex®-4 FX Field Programmable Gate Array (FPGA) IC

The XC4VFX60-11FF1152I is a Virtex®-4 FX field programmable gate array (FPGA) offered in a 1152-ball FCBGA package. It provides a high-density programmable logic fabric with substantial on-chip memory and a large I/O count for systems requiring reconfigurable logic and complex interfacing.

Key characteristics include 63,20 configurable logic blocks (CLBs) equivalent coverage and 56,880 logic elements, approximately 4.28 Mbits of embedded memory, and a 576-pin I/O capability, all in an industrial-grade component rated for surface-mount applications.

Key Features

  • Programmable Logic Capacity — 63,20 CLBs and 56,880 logic elements provide high logic density for complex designs and custom digital functions.
  • Embedded Memory — Approximately 4.28 Mbits of on-chip RAM to support data buffering, state storage, and fast on-chip data paths.
  • High I/O Count — 576 user I/O pins to support broad interfacing options and parallel data throughput.
  • Power Supply Range — Operates from 1.14 V to 1.26 V, enabling defined core power supply conditions for system design.
  • Package and Mounting — 1152-FCBGA (35 × 35) package in a 1152-BBGA format with surface-mount mounting type for compact board integration.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

  • Complex Digital Systems — Use the programmable logic and high logic element count to implement customized digital processing pipelines and protocol engines.
  • High-Density I/O Interfaces — Leverage 576 I/Os for wide parallel buses, multi-channel data acquisition, and extensive peripheral connectivity.
  • On-Chip Memory-Dependent Designs — Utilize approximately 4.28 Mbits of embedded memory for buffering, FIFOs, and lookup tables in real-time data processing.

Unique Advantages

  • High Logic Density: 56,880 logic elements enable integration of complex functions into a single device, reducing external logic and BOM count.
  • Substantial Embedded Memory: Approximately 4.28 Mbits of on-chip RAM simplifies data path design and reduces dependence on external memory.
  • Extensive I/O Capability: 576 user I/Os support broad peripheral and bus interfacing without additional I/O expanders.
  • Industrial Robustness: Rated for −40 °C to 100 °C operation to support deployment in industrial temperature environments.
  • Compact Surface-Mount Package: 1152-FCBGA (35 × 35) provides a compact footprint for high-density board layouts while maintaining thermal and electrical connections.
  • Regulatory Compliance: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose XC4VFX60-11FF1152I?

The XC4VFX60-11FF1152I positions itself as a high-capacity, industrial-grade FPGA option for designs that require substantial programmable logic, embedded memory, and a large number of I/Os in a compact surface-mount package. Its voltage and temperature ratings provide clear electrical and environmental parameters for system integration.

This device is well suited to engineering teams designing complex digital systems where on-chip memory, dense logic resources, and extensive interfacing are core requirements. Its package and compliance characteristics support straightforward integration into industrial applications with a focus on long-term deployment.

Request a quote or submit inquiry details to receive pricing and availability for the XC4VFX60-11FF1152I. Our team can assist with lead times, volume pricing, and ordering information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up