XC4VFX60-11FF1152I
| Part Description |
Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 576 4276224 56880 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,427 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 576 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 6320 | Number of Logic Elements/Cells | 56880 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4276224 |
Overview of XC4VFX60-11FF1152I – Virtex®-4 FX Field Programmable Gate Array (FPGA) IC
The XC4VFX60-11FF1152I is a Virtex®-4 FX field programmable gate array (FPGA) offered in a 1152-ball FCBGA package. It provides a high-density programmable logic fabric with substantial on-chip memory and a large I/O count for systems requiring reconfigurable logic and complex interfacing.
Key characteristics include 63,20 configurable logic blocks (CLBs) equivalent coverage and 56,880 logic elements, approximately 4.28 Mbits of embedded memory, and a 576-pin I/O capability, all in an industrial-grade component rated for surface-mount applications.
Key Features
- Programmable Logic Capacity — 63,20 CLBs and 56,880 logic elements provide high logic density for complex designs and custom digital functions.
- Embedded Memory — Approximately 4.28 Mbits of on-chip RAM to support data buffering, state storage, and fast on-chip data paths.
- High I/O Count — 576 user I/O pins to support broad interfacing options and parallel data throughput.
- Power Supply Range — Operates from 1.14 V to 1.26 V, enabling defined core power supply conditions for system design.
- Package and Mounting — 1152-FCBGA (35 × 35) package in a 1152-BBGA format with surface-mount mounting type for compact board integration.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
- RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.
Typical Applications
- Complex Digital Systems — Use the programmable logic and high logic element count to implement customized digital processing pipelines and protocol engines.
- High-Density I/O Interfaces — Leverage 576 I/Os for wide parallel buses, multi-channel data acquisition, and extensive peripheral connectivity.
- On-Chip Memory-Dependent Designs — Utilize approximately 4.28 Mbits of embedded memory for buffering, FIFOs, and lookup tables in real-time data processing.
Unique Advantages
- High Logic Density: 56,880 logic elements enable integration of complex functions into a single device, reducing external logic and BOM count.
- Substantial Embedded Memory: Approximately 4.28 Mbits of on-chip RAM simplifies data path design and reduces dependence on external memory.
- Extensive I/O Capability: 576 user I/Os support broad peripheral and bus interfacing without additional I/O expanders.
- Industrial Robustness: Rated for −40 °C to 100 °C operation to support deployment in industrial temperature environments.
- Compact Surface-Mount Package: 1152-FCBGA (35 × 35) provides a compact footprint for high-density board layouts while maintaining thermal and electrical connections.
- Regulatory Compliance: RoHS compliance supports lead-free manufacturing and environmental requirements.
Why Choose XC4VFX60-11FF1152I?
The XC4VFX60-11FF1152I positions itself as a high-capacity, industrial-grade FPGA option for designs that require substantial programmable logic, embedded memory, and a large number of I/Os in a compact surface-mount package. Its voltage and temperature ratings provide clear electrical and environmental parameters for system integration.
This device is well suited to engineering teams designing complex digital systems where on-chip memory, dense logic resources, and extensive interfacing are core requirements. Its package and compliance characteristics support straightforward integration into industrial applications with a focus on long-term deployment.
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