XC4VFX60-11FF672I

The XC4VFX60-11FF672I is a Virtex-4 FX field programmable gate array from AMD. It provides high logic density with 56,880 logic elements and approximately 4.28 Mbits of on-chip RAM in a 672-ball FCBGA package.

Designed for industrial applications, the device offers 352 device I/O, a supply voltage range of 1.14 V to 1.26 V, surface-mount packaging, and an operating temperature range of −40 °C to 100 °C, enabling use in robust embedded systems that require substantial logic and memory integration.

Key Features

• Logic Capacity  56,880 logic elements (6,320 CLBs) for implementing high-density custom logic and control functions.
• Embedded Memory  Approximately 4.28 Mbits of on-chip RAM to support state machines, buffering, and local data storage.
• I/O Resources  352 device I/O pins to accommodate multiple high-density interfaces and peripheral connections.
• Power Supply  Core supply range of 1.14 V to 1.26 V, supporting stable core operation within specified limits.
• Package  672-FCBGA (27 × 27) surface-mount package provides a compact, solderable footprint for high-pin-count designs.
• Industrial Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.

Typical Applications

• Industrial Control  Implement control logic, sequencing, and custom I/O handling where industrial temperature range and reliability are required.
• High-density I/O Interfaces  Aggregate and route multiple interfaces or sensor arrays using the device’s 352 I/O pins and programmable logic.
• Custom Logic and State Machines  Deploy complex finite-state machines and application-specific logic backed by on-chip RAM for buffering and local storage.
• OEM Embedded Systems  Integrate into embedded products requiring a high-logic-count FPGA in a compact FCBGA package for volume or space-constrained designs.

Unique Advantages

• High Logic Density: 56,880 logic elements enable complex designs and extensive custom logic integration without extra external components.
• Significant On-chip Memory: Approximately 4.28 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Ample I/O Availability: 352 device I/O pins simplify connection to multiple peripherals, interfaces, and sensors.
• Industrial Qualification: Industrial-grade temperature range (−40 °C to 100 °C) supports deployment in harsh and temperature-varying environments.
• Compact High-pin-count Package: 672-FCBGA (27 × 27) provides high pin-count routing in a compact surface-mount form factor for dense PCB layouts.

Why Choose XC4VFX60-11FF672I?

The XC4VFX60-11FF672I delivers a balanced combination of high logic capacity, substantial on-chip memory, and broad I/O in a single industrial-grade FPGA package. These characteristics make it well suited for embedded designs and industrial systems that demand reliable operation across a wide temperature range and substantial programmable resources on-chip.

For designs requiring a compact, surface-mount, high-pin-count FPGA with verified operating limits and clear electrical parameters, the XC4VFX60-11FF672I provides a verifiable option that aligns logic density, memory, and I/O capability in a 672-FCBGA platform.

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