XC4VFX60-11FFG672I

The XC4VFX60-11FFG672I is a Virtex-4 FX Field Programmable Gate Array (FPGA) IC from AMD. It delivers a combination of large logic capacity, on-chip memory, and a high I/O count in a 672-ball FCBGA surface-mount package.

Built and graded for industrial use, the device features 56,880 logic elements, approximately 4.28 Mbits of embedded RAM, 352 I/Os, a 672-FCBGA (27×27) package, a 1.14 V–1.26 V supply range, and an operating temperature range of –40 °C to 100 °C. The device is RoHS compliant.

Key Features

• Core and Architecture Virtex-4 FX Field Programmable Gate Array from AMD, optimized for programmable logic integration.
• Logic Capacity 6,320 configurable logic blocks (CLBs) and 56,880 logic elements provide broad resources for complex logic implementations.
• Embedded Memory Total on-chip RAM of 4,276,224 bits (approximately 4.28 Mbits) for buffering, lookup tables, and local data storage.
• I/O and Package 352 I/O pins in a 672-FCBGA (27×27) package; surface-mount mounting supports compact PCB implementation.
• Power Core voltage supply range from 1.14 V to 1.26 V for predictable power planning.
• Thermal and Grade Industrial grade device with an operating temperature range of –40 °C to 100 °C for demanding environments.
• Regulatory RoHS compliant.

Typical Applications

• High-density programmable logic designs — Leverage the 56,880 logic elements and 6,320 CLBs to implement large-scale combinational and sequential logic functions on a single device.
• Memory-intensive functions — Approximately 4.28 Mbits of embedded RAM supports on-chip buffering, FIFOs, and lookup operations where local memory is required.
• I/O-heavy systems — 352 I/Os accommodate extensive external interfacing and sensor or peripheral connectivity in compact surface-mount designs.
• Industrial embedded systems — Industrial grade and –40 °C to 100 °C operating range suit deployments that require extended temperature tolerance and stable operation.

Unique Advantages

• High logic density: 56,880 logic elements and 6,320 CLBs support complex designs without immediate migration to larger devices.
• Substantial on-chip memory: Approximately 4.28 Mbits of embedded RAM reduces external memory dependence and simplifies board-level design.
• Generous I/O complement: 352 I/Os provide flexibility for multiple interfaces and parallel connections.
• Industrial temperature rating: –40 °C to 100 °C capability enables use in temperature-challenging environments.
• Compact FCBGA package: 672-FCBGA (27×27) supports high-density, surface-mount PCB implementations.
• Environmental compliance: RoHS status helps meet regulatory and customer environmental requirements.

Why Choose XC4VFX60-11FFG672I?

The XC4VFX60-11FFG672I combines the Virtex-4 FX FPGA architecture with substantial logic, embedded memory, and a high I/O count in a compact 672-FCBGA package. Its industrial grade and wide operating temperature range make it suitable for designs that require robust operation across challenging conditions.

This device is appropriate for engineers and procurement teams seeking a single-chip programmable logic solution that balances integration, on-chip memory capacity, and extensive external interfacing, while meeting RoHS environmental requirements.

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