XC4VFX60-11FFG672C

The XC4VFX60-11FFG672C is a Virtex-4 FX Field Programmable Gate Array (FPGA) IC in a 672-ball FCBGA package. It combines a high count of programmable logic elements, on-chip embedded memory, and a large I/O complement in a surface-mount 672-FCBGA (27×27) package for commercial-grade designs.

Designed for applications that require reconfigurable digital logic, substantial embedded memory, and extensive I/O, the device delivers a balance of integration and flexibility while operating within a 1.14 V to 1.26 V core supply range and a 0 °C to 85 °C operating temperature window.

Key Features

• High logic capacity — Provides 56,880 logic elements to implement complex programmable logic functions and custom hardware architectures.
• Substantial embedded memory — Approximately 4.28 Mbits of on-chip RAM (4,276,224 bits) to support data buffering, FIFOs, and local storage without external memory dependency.
• Large I/O complement — 352 user I/O pins to support multiple parallel interfaces, peripherals, and board-level connections.
• Compact FCBGA package — Supplier device package: 672-FCBGA (27×27) in a 672-BBGA format, optimized for surface-mount assembly.
• Low-voltage core — Core voltage supply range of 1.14 V to 1.26 V for compatibility with low-voltage FPGA power architectures.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
• RoHS compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Custom programmable logic — Implement tailored digital functions and hardware accelerators using the device's extensive logic resources and on-chip memory.
• High-pin-count interface handling — Use the 352 I/O pins to aggregate multiple parallel interfaces and board-level signals in a single device.
• Embedded system integration — Combine logic, memory, and I/O in a compact FCBGA package for space-constrained commercial designs.

Unique Advantages

• High-density logic: 56,880 logic elements support substantial design complexity without immediate need for multiple devices.
• On-chip RAM capacity: Approximately 4.28 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• Flexible I/O resources: 352 I/Os enable broad connectivity options for parallel interfaces and multi-peripheral systems.
• Compact, manufacturable package: 672-FCBGA (27×27) surface-mount package simplifies board integration while maintaining a high pin count.
• Commercial-grade operation: Rated 0 °C to 85 °C with RoHS compliance for standard commercial product lifecycles and assembly processes.
• Predictable power envelope: Core supply range of 1.14 V to 1.26 V supports integration into low-voltage power domains.

Why Choose XC4VFX60-11FFG672C?

The XC4VFX60-11FFG672C positions itself as a high-capacity, commercially graded FPGA that brings together large logic resources, meaningful on-chip memory, and extensive I/O in a single compact FCBGA package. It is suitable for designers seeking a reconfigurable solution that consolidates digital logic, embedded RAM, and interface connectivity into one device.

This FPGA fits projects and teams that need scalability within commercial temperature ranges and RoHS-compliant manufacturing. Its combination of logic density, memory, and I/O makes it a practical choice for development of custom hardware functions, interface aggregation, and embedded system integration where a surface-mount, high-pin-count package is required.

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