XC4VFX60-11FF672C

IC FPGA 352 I/O 672FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 352 4276224 56880 672-BBGA, FCBGA

Quantity 1,787 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGA, FCBGANumber of I/O352Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6320Number of Logic Elements/Cells56880
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4276224

Overview of XC4VFX60-11FF672C – Virtex®-4 FX FPGA, 672‑FCBGA, 352 I/O

The XC4VFX60-11FF672C is a Virtex®-4 FX field programmable gate array (FPGA) from AMD, supplied in a 672‑FCBGA (27×27) package for surface-mount assembly. It consolidates a large logic resource set with significant on-chip RAM and a broad I/O complement for designs that require programmable logic integration.

Specified for commercial applications, this device operates from a 1.14 V to 1.26 V supply and is rated for an operating temperature range of 0 °C to 85 °C. It is RoHS compliant.

Key Features

  • Logic Capacity  56,880 logic elements (cells) provide substantial programmable logic resources for complex functions and custom logic implementations.
  • Embedded Memory  Approximately 4.3 Mbits of on-chip RAM (4,276,224 bits) for buffering, LUT-based memory, and storage of intermediate data.
  • I/O Resources  352 user I/O pins to interface with external peripherals, sensors, and high-density connectors.
  • Package and Mounting  672‑FCBGA (27×27) ball‑grid array in a surface-mount form factor for compact board integration.
  • Power  Operates from a 1.14 V to 1.26 V supply range to match system voltage rails and power requirements.
  • Temperature and Grade  Commercial grade device rated for 0 °C to 85 °C operation.
  • Compliance  RoHS compliant.

Unique Advantages

  • High logic density: 56,880 logic elements enable implementation of sizable custom logic and parallel datapaths on a single device, reducing the need for multiple FPGAs.
  • Substantial embedded RAM: Approximately 4.3 Mbits of on-chip memory supports buffering and state storage without immediate reliance on external memory.
  • Generous I/O count: 352 I/O pins provide flexibility for multi-channel interfaces, parallel buses, and mixed-signal front ends.
  • Compact FCBGA package: 672‑ball FCBGA (27×27) delivers a compact footprint for space-constrained designs while maintaining high connector density.
  • Commercial temperature rating: 0 °C to 85 °C specification aligns with a wide range of general-purpose electronic products.
  • RoHS compliance: Helps support regulatory requirements for lead-free designs.

Why Choose XC4VFX60-11FF672C?

The XC4VFX60-11FF672C positions itself as a versatile, high-capacity Virtex‑4 FX FPGA option for designers needing extensive programmable logic, embedded memory, and a high I/O count in a compact surface-mount FCBGA package. Its electrical and thermal specifications make it suitable for commercial electronic systems that require integrated, reconfigurable logic resources.

Choose this device when your design roadmap calls for significant on-chip logic and memory density, a large number of external interfaces, and a compact package footprint—backed by AMD's Virtex‑4 FX family lineage and RoHS compliance for lead-free implementations.

Request a quote or submit a pricing inquiry to check availability and obtain a tailored proposal for the XC4VFX60-11FF672C.

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