XC4VFX60-12FFG1152C

The XC4VFX60-12FFG1152C is a Virtex®-4 FX Field Programmable Gate Array (FPGA) IC offering high-density programmable logic, embedded memory, and a large I/O complement in a 1152-FCBGA package. It combines 56,880 logic elements, approximately 4.28 Mbits of on-chip RAM, and 576 I/Os to support complex digital designs that require dense logic resources and significant memory capacity.

Key Features

• Core Logic 56,880 logic elements provide a high logic resource pool for custom digital implementations and complex IP integration.
• Embedded Memory Approximately 4.28 Mbits of on-chip RAM for data buffering, lookup tables, and temporary storage within the FPGA fabric.
• I/O Capacity 576 user I/Os to support wide parallel interfaces, multiple peripheral connections, and high-pin-count board-level designs.
• Power Supported core voltage supply range from 1.14 V to 1.26 V for predictable power planning in system designs.
• Package & Mounting 1152-FCBGA (35 × 35) package with surface-mount mounting type for high-density PCB integration.
• Operating Range & Grade Commercial grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance RoHS compliant to support regulatory requirements for lead-free assembly.

Typical Applications

• Custom Digital Logic — Implement complex state machines, protocol bridges, and bespoke processing pipelines using the device’s large logic element count.
• High‑I/O Systems — Drive board-level interfaces and parallel buses that require a high number of user I/Os.
• On‑chip Data Buffering — Use the approximately 4.28 Mbits of embedded RAM for buffering, packet handling, or temporary storage within logic flows.
• Prototyping and FPGA‑based Development — Deploy dense logic and memory resources in development platforms and hardware prototypes.

Unique Advantages

• High Logic Density: 56,880 logic elements enable consolidation of complex functions into a single device, reducing BOM and board complexity.
• Significant On‑Chip Memory: Approximately 4.28 Mbits of embedded RAM supports data buffering and local storage without external memory.
• Extensive I/O Resources: 576 I/Os provide flexibility for multiple interfaces and parallel connectivity on a single FPGA.
• Compact, High‑Pin Package: The 1152‑FCBGA (35×35) package delivers high pin count in a compact surface‑mount footprint suitable for dense PCB layouts.
• Predictable Power Envelope: Defined core voltage range (1.14 V–1.26 V) simplifies power-supply design and system integration.
• RoHS Compliant and Commercial Grade: Meet common regulatory and assembly requirements for commercial applications.

Why Choose XC4VFX60-12FFG1152C?

The XC4VFX60-12FFG1152C positions itself as a high-density, feature-rich FPGA solution for designers who need substantial programmable logic, on-chip memory, and a large number of I/Os in a single package. Its combination of 56,880 logic elements, approximately 4.28 Mbits of embedded RAM, and 576 I/Os makes it well suited to compact designs that require integration of multiple digital functions without relying heavily on external components.

With a 1152‑FCBGA surface-mount package, commercial operating range, and RoHS compliance, this device supports robust board-level integration and procurement for commercial electronic products. It is appropriate for design teams seeking a scalable FPGA resource set with clear hardware parameters for power, thermal, and I/O planning.

Request a quote or submit a purchase inquiry to receive pricing and availability for the XC4VFX60-12FFG1152C. Our team can provide the information you need to move your design forward.