XC4VLX100-10FF1513C
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 960 4423680 110592 1513-BBGA, FCBGA |
|---|---|
| Quantity | 331 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1513-FCBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1513-BBGA, FCBGA | Number of I/O | 960 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 12288 | Number of Logic Elements/Cells | 110592 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4423680 |
Overview of XC4VLX100-10FF1513C – Virtex®-4 LX FPGA, 1513-FCBGA (40×40), Commercial
The XC4VLX100-10FF1513C is a Virtex‑4 LX field programmable gate array (FPGA) manufactured by AMD. It provides a high density of programmable logic and I/O in a 1513‑FBG A FCBGA package targeted at commercial applications.
With 110,592 logic elements, approximately 4.4 Mbits of embedded memory and 960 I/O pins, this device is suitable for designs that require substantial on‑chip resources and a large external connectivity surface within a surface‑mount FCBGA package.
Key Features
- Logic Capacity 110,592 logic elements and 12,288 CLBs provide substantial programmable resources for complex digital designs.
- Embedded Memory Approximately 4.4 Mbits of on‑chip RAM to support buffering, state storage, and intermediate data processing without external memory.
- I/O Density 960 user I/O pins enable extensive external interfacing and support for multi‑channel designs.
- Power Supply Range Operates from a core voltage supply between 1.14 V and 1.26 V, allowing designers to plan power delivery and sequencing accordingly.
- Package and Mounting 1513‑FCBGA (1513‑BBGA) package, supplier device package 1513‑FCBGA (40×40), designed for surface‑mount assembly.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for typical commercial environments.
- Environmental Compliance RoHS compliant to meet common environmental requirements.
Typical Applications
- High‑density digital systems Use the device where large amounts of programmable logic and embedded memory are required to implement complex state machines, data paths, and custom processing engines.
- Communications and I/O intensive equipment Leverage 960 I/O pins to interface with multiple lanes, peripherals, or I/O standards in commercial communications hardware.
- Prototype and development platforms Deploy the FPGA in evaluation or development systems that need substantial on‑chip resources for iterative design and verification.
- Embedded processing and acceleration Combine logic density and on‑chip RAM to accelerate data handling, buffering, and application‑specific computations.
Unique Advantages
- High on‑chip resource density: 110,592 logic elements and 12,288 CLBs enable integration of complex functions on a single device, reducing board‑level component count.
- Generous embedded memory: Approximately 4.4 Mbits of RAM supports large internal buffers and state storage, minimizing dependency on external memory for many use cases.
- Extensive external connectivity: 960 I/O pins provide flexibility for multi‑channel interfaces, broad peripheral support, and high‑pin‑count systems.
- Compact FCBGA packaging: 1513‑FCBGA (40×40) delivers a compact, surface‑mount package option that preserves board area while offering high pin count.
- Commercial operating range: 0 °C to 85 °C rating suits a wide range of non‑industrial commercial products and development systems.
- RoHS compliant: Conforms to RoHS environmental requirements for ease of regulatory compliance.
Why Choose XC4VLX100-10FF1513C?
The XC4VLX100-10FF1513C balances substantial programmable logic, embedded memory and extensive I/O in a single FCBGA package. Its combination of 110,592 logic elements, approximately 4.4 Mbits of on‑chip RAM and 960 I/O pins makes it well suited to designers who need to consolidate complex digital functions and heavy I/O requirements into a compact surface‑mount form factor.
Targeted at commercial applications, this Virtex‑4 LX FPGA is a practical option for teams building high‑density digital systems, communications hardware, and prototyping platforms that require verified resource counts, a defined voltage supply window, and a commercial temperature rating.
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