XC4VLX100-10FFG1148C

IC FPGA 768 I/O 1148FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 768 4423680 110592 1148-BBGA, FCBGA

Quantity 275 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1148-FCPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1148-BBGA, FCBGANumber of I/O768Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs12288Number of Logic Elements/Cells110592
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4423680

Overview of XC4VLX100-10FFG1148C – Virtex®-4 LX FPGA, 110,592 Logic Elements, 768 I/O

The XC4VLX100-10FFG1148C is a Virtex®-4 LX field programmable gate array (FPGA) IC from AMD. It delivers high logic capacity and a large I/O count in a surface-mount FCBGA package suitable for commercial electronic designs. With substantial on-chip memory and a defined core voltage and temperature range, this device targets designs that require significant embedded logic, memory resources, and extensive connectivity.

Key Features

  • Logic Capacity — 110,592 logic elements provide extensive programmable logic resources for complex digital implementations.
  • Embedded Memory — Approximately 4.42 Mbits of embedded memory (4,423,680 total RAM bits) for buffering, FIFOs, and on-chip data storage.
  • I/O Density — 768 configurable I/O pins to support high-port-count interfaces and dense board-level connectivity.
  • Package & Mounting — 1148-BBGA FCBGA package, supplier device package 1148-FCPBGA (35×35), designed for surface-mount assembly.
  • Power — Supported core voltage range from 1.14 V to 1.26 V to match system power planning and regulator specifications.
  • Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • High-density digital designs — Implement complex custom logic functions using the device’s 110,592 logic elements.
  • Systems requiring extensive I/O — Use the 768 I/O pins for multi-channel interfaces, expansion headers, or parallel bus connections.
  • On-chip buffering and data handling — Leverage approximately 4.42 Mbits of embedded memory for data buffering, FIFOs, and temporary storage.

Unique Advantages

  • High logic integration: 110,592 logic elements reduce the need for multiple discrete devices and simplify board-level design.
  • Large on-chip memory: Approximately 4.42 Mbits of embedded RAM supports substantial local storage for deterministic data paths.
  • Extensive I/O capacity: 768 I/O pins enable dense connectivity without additional I/O expanders.
  • Compact FCBGA packaging: 1148-BBGA (35×35) package provides high pin-count in a surface-mount form factor for space-constrained layouts.
  • Defined power envelope: Core voltage range of 1.14 V to 1.26 V helps align power-supply design and thermal planning.
  • Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial applications where that range is appropriate.

Why Choose XC4VLX100-10FFG1148C?

The XC4VLX100-10FFG1148C combines Virtex®-4 LX architecture with a high logic element count, substantial embedded memory, and a large number of I/Os to address demanding programmable logic tasks in commercial electronics. Its FCBGA packaging and surface-mount form factor deliver a compact, high-density solution for designs that need significant on-chip resources.

This part is suited for design teams and procurement professionals seeking a commercially graded FPGA with clear electrical and thermal parameters, RoHS compliance, and a balance of logic, memory, and I/O capacity for scalable digital system implementation.

Please request a quote or submit a purchase inquiry to receive pricing and availability for the XC4VLX100-10FFG1148C.

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