XC4VLX100-11FF1148I
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 768 4423680 110592 1148-BBGA, FCBGA |
|---|---|
| Quantity | 1,362 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1148-FCPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1148-BBGA, FCBGA | Number of I/O | 768 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 12288 | Number of Logic Elements/Cells | 110592 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4423680 |
Overview of XC4VLX100-11FF1148I – Virtex®-4 LX FPGA, 110,592 logic elements, 1148-BBGA
The XC4VLX100-11FF1148I is a Virtex®-4 LX field programmable gate array (FPGA) IC from AMD. It delivers a large programmable fabric with 110,592 logic elements and 12,288 CLBs in a high-density package.
With approximately 4.42 Mbits of on-chip RAM, 768 user I/Os, an industrial operating temperature range (−40 °C to 100 °C), and a compact 1148-BBGA (35×35 mm FCPBGA) package, this device is aimed at designs that require significant logic capacity and high I/O density while meeting industrial temperature and mounting requirements.
Key Features
- Core Architecture 110,592 logic elements across 12,288 CLBs provide substantial programmable logic capacity for complex digital designs.
- Embedded Memory Approximately 4.42 Mbits of on-chip RAM supports buffering, frame storage, and other memory-intensive functions without external memory for many use cases.
- I/O Density 768 user I/O pins enable wide parallel connectivity to sensors, transceivers, interfaces, and external peripherals.
- Power Operates from a 1.14 V to 1.26 V core supply range, suitable for the device’s specified operating conditions.
- Package & Mounting 1148-BBGA (1148-FCPBGA, 35×35 mm) surface-mount package optimizes board-level density and thermal performance.
- Temperature & Grade Industrial grade device rated for −40 °C to 100 °C operation for deployment in temperature-challenged environments.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Implements real-time logic, control sequencing, and I/O aggregation in industrial automation equipment within an industrial temperature envelope.
- High-Density Digital Processing Hosts large custom datapaths or parallel processing blocks that leverage the device’s extensive logic elements and embedded RAM.
- I/O-Intensive Systems Interfaces multiple external devices or high-channel-count subsystems using up to 768 user I/Os for broad connectivity.
- Embedded System Integration Provides on-chip resources to consolidate functions and reduce external component count in complex embedded designs.
Unique Advantages
- High programmable logic capacity: 110,592 logic elements and 12,288 CLBs accommodate complex custom logic and large state machines.
- Substantial on-chip RAM: Approximately 4.42 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
- Extensive I/O complement: 768 user I/Os deliver flexibility for parallel interfaces, multi-channel data capture, and comprehensive system integration.
- Industrial temperature rating: Specified −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
- Compact, high-density package: 1148-FCPBGA (35×35 mm) provides a balance of pin count and board space for dense designs.
- RoHS compliant: Meets common lead-free manufacturing requirements.
Why Choose XC4VLX100-11FF1148I?
The XC4VLX100-11FF1148I combines a large logic fabric, significant embedded memory, and a high I/O count in a compact industrial-grade package, making it well suited for designs that require high integration and robust operation across a wide temperature range. As a Virtex®-4 LX device from AMD, it provides the resources needed to consolidate multiple functions into a single programmable device.
This part is appropriate for engineering teams and procurement seeking a high-capacity FPGA in a surface-mount 1148-BBGA package with defined voltage and temperature specifications, offering a balance of performance and integration for demanding embedded and industrial applications.
Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the XC4VLX100-11FF1148I.

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