XC4VLX100-11FF1513I

The XC4VLX100-11FF1513I is a Virtex®-4 LX Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1513-FCBGA (1513-BBGA) package. It provides substantial on-chip resources—110,592 logic elements, approximately 4.4 Mbits of embedded memory and 960 general-purpose I/O—targeting designs that require high logic density, extensive I/O and significant embedded RAM capacity. The device is rated for industrial operation with a core supply range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C.

Key Features

• Core Logic  110,592 logic elements for implementing complex custom logic, state machines and datapaths.
• Embedded Memory  Approximately 4.4 Mbits of on-chip RAM, enabling large buffers, FIFOs and local storage for high-throughput designs.
• I/O Capacity  960 I/O pins to support broad connectivity requirements for parallel interfaces, bus fabrics and board-level routing.
• Package  1513-FCBGA (1513-BBGA) FCBGA package (40×40) providing a high-pin-count, board-level footprint for dense system integration.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power-rail design targets.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Conforms to RoHS requirements for lead-free assembly and regulatory compliance.

Typical Applications

• High-density digital processing  Implement custom datapaths and accelerators using the large logic element count and embedded memory.
• Telecommunications and Networking  Use extensive I/O and on-chip RAM for packet processing, buffering and interface bridging.
• Industrial Control and Automation  Deploy in control systems that require robust operation across -40 °C to 100 °C and broad I/O connectivity.
• Test, Measurement and Data Acquisition  Build signal conditioning, data aggregation and real-time processing blocks leveraging embedded RAM and logic density.

Unique Advantages

• High logic density: 110,592 logic elements enable consolidation of complex functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 4.4 Mbits of embedded RAM supports large buffers and local data processing without external memory.
• Extensive I/O resources: 960 I/O pins provide flexibility for multiple parallel interfaces and high-pin-count system designs.
• Industrial-grade operation: Specified for -40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact high-pin-count package: 1513-FCBGA (40×40) offers a dense footprint for complex designs where PCB real estate and routing density matter.
• Controlled core power range: 1.14 V to 1.26 V core supply simplifies power-rail planning for the FPGA core.

Why Choose XC4VLX100-11FF1513I?

The XC4VLX100-11FF1513I positions itself as a high-capacity FPGA for designs that require a combination of significant logic resources, on-chip memory and broad I/O in a single, industrial-rated package. Its 110,592 logic elements, approximately 4.4 Mbits of embedded RAM and 960 I/O make it suitable for consolidating complex digital functions and interfaces on one device while operating across a wide temperature range.

This device is well suited to engineers and procurement teams designing systems that prioritize integration density, on-chip buffering and robust industrial operation. Its combination of resources supports scalable implementation of compute-intensive, interface-rich and memory-dependent designs.

Request a quote or submit an inquiry to receive pricing and availability for the XC4VLX100-11FF1513I and to discuss how it can fit into your next FPGA-based design.