XC4VFX20-11FFG672I

The XC4VFX20-11FFG672I is a Field Programmable Gate Array (FPGA) IC from AMD designed for industrial applications. It combines programmable logic resources, embedded memory and a high I/O count in a 672-FCBGA (27×27) package to support compact, board-level designs.

With a core supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, this device is intended for systems that require reconfigurable logic, significant on-chip memory and robust environmental tolerance.

Key Features

• Programmable Logic 2,136 logic elements and 19,224 logic cells provide the programmable fabric required for custom digital functions and control logic.
• Embedded Memory Approximately 1.25 Mbits of embedded memory (1,253,376 total RAM bits) for buffering, state storage and data processing on-chip.
• I/O Capacity 320 I/O pins to support multiple external interfaces and peripheral connections on a single device.
• Power Core voltage supply range of 1.14 V to 1.26 V for the FPGA core.
• Package 672-BBGA, FCBGA package (supplier device package: 672-FCBGA, 27×27) for a compact, solder-down surface-mount implementation.
• Operating Range Industrial-grade operating temperature from −40 °C to 100 °C to meet a wide range of environmental conditions.
• RoHS Compliance RoHS-compliant device suitable for designs requiring lead-free components.
• Mounting Surface-mount package for standard PCB assembly processes.

Typical Applications

• Industrial Control Use the FPGA to implement custom control logic and interface to sensors and actuators, leveraging the device’s industrial temperature range and abundant I/O.
• Embedded Systems Integrate programmable logic and on-chip memory to handle data buffering, protocol bridging or custom peripheral functions within compact board designs.
• Communications and Interface Bridging Deploy the device where multiple I/O channels and on-chip RAM are needed to aggregate, buffer and reformat data between subsystems.

Unique Advantages

• High Integration: Combine tens of thousands of logic cells with approximately 1.25 Mbits of on-chip memory to reduce external components and simplify board design.
• Substantial I/O Count: 320 I/O pins enable connectivity to multiple peripherals and interfaces without external multiplexing.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in demanding environmental conditions.
• Compact FCBGA Package: 672-FCBGA (27×27) package delivers a dense pinout in a space-efficient form factor suitable for surface-mount assembly.
• Controlled Core Voltage: Narrow core supply window (1.14 V to 1.26 V) simplifies power-rail design for the FPGA core.
• RoHS Compliance: Meets lead-free requirements for environments requiring compliant components.

Why Choose XC4VFX20-11FFG672I?

The XC4VFX20-11FFG672I positions itself as a reliable, industrial-grade FPGA option that balances programmable logic capacity, embedded memory and a high I/O count in a compact 672-FCBGA package. Its operating temperature range and RoHS compliance make it suitable for long-life industrial and embedded deployments where on-board reconfigurability and integration matter.

This device is a strong candidate for designers and procurement teams building industrial control, embedded processing or communications interface solutions that require a combination of logic density, on-chip RAM and substantial external connectivity, backed by AMD manufacturing.

Request a quote or submit a purchase inquiry to evaluate XC4VFX20-11FFG672I for your next design.