XC4VFX20-11FF672C

IC FPGA 320 I/O 672FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 320 1253376 19224 672-BBGA, FCBGA

Quantity 1,223 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGA, FCBGANumber of I/O320Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2136Number of Logic Elements/Cells19224
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1253376

Overview of XC4VFX20-11FF672C – Virtex®-4 FX FPGA, 320 I/O, 672-FCBGA

The XC4VFX20-11FF672C is a Virtex®-4 FX field programmable gate array (FPGA) IC from AMD. It delivers a combination of programmable logic, on-chip embedded memory and a high count of I/O for configurable digital designs.

With 19,224 logic elements, approximately 1.25 Mbits of embedded memory and 320 I/O pins in a 672-ball FCBGA package, this commercial-grade FPGA is targeted at applications that require substantial logic capacity, embedded RAM and broad I/O integration.

Key Features

  • Programmable Logic 19,224 logic elements provide the core configurable resources for implementing custom digital logic and state machines.
  • Embedded Memory Approximately 1.25 Mbits of on-chip RAM for buffering, lookup tables and localized data storage.
  • I/O Density 320 I/O pins to support wide parallel interfaces, multiple peripherals or dense board-level connectivity.
  • Package & Mounting Supplied in a 672-BBGA / 672-FCBGA (27×27) package and intended for surface-mount PCB assembly.
  • Power Specified core voltage range of 1.14 V to 1.26 V to match system power-rail requirements.
  • Operating Conditions Commercial grade device rated for operation from 0 °C to 85 °C.
  • Compliance RoHS compliant for alignment with standard environmental requirements.

Typical Applications

  • High-density I/O Control Use the 320 I/O pins to interface with multiple peripherals, sensors or parallel data streams.
  • Custom Digital Processing Leverage 19,224 logic elements and on-chip RAM for implementing application-specific processing blocks and state machines.
  • Embedded Memory Functions Approximately 1.25 Mbits of embedded RAM can be used for buffering, packet handling or small data stores close to logic.

Unique Advantages

  • Balanced Logic and Memory: The combination of 19,224 logic elements and ~1.25 Mbits of embedded RAM supports complex logic designs with local memory needs without external SRAM for many use cases.
  • High I/O Count: 320 I/O pins allow for flexible board-level partitioning and the ability to connect multiple interfaces directly to the FPGA.
  • Compact FCBGA Package: The 672-ball FCBGA (27×27) package delivers high pin count in a compact footprint suitable for surface-mount assembly.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C operation to meet general commercial electronics deployment requirements.
  • RoHS Compliant: Environmentally compliant construction for projects that require lead-free components.

Why Choose XC4VFX20-11FF672C?

The XC4VFX20-11FF672C positions itself as a versatile Virtex®-4 FX FPGA option where a mix of significant logic capacity, embedded memory and high I/O count is required. Its package and surface-mount mounting style make it suitable for compact board designs that need robust programmable logic resources within a commercial temperature range.

Designed and manufactured by AMD and RoHS compliant, this FPGA is appropriate for development teams and procurement looking for a commercially graded, high-density programmable device with clearly specified voltage and thermal operating windows.

If you need pricing, availability or a formal quote for XC4VFX20-11FF672C, request a quote or submit an inquiry to receive details on ordering and lead times.

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