XC4VLX25-12SFG363C

IC FPGA 240 I/O 363FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 1327104 24192 363-FBGA, FCBGA

Quantity 1,677 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package363-FCBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case363-FBGA, FCBGANumber of I/O240Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1327104

Overview of XC4VLX25-12SFG363C – Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 1327104 24192 363-FBGA, FCBGA

The XC4VLX25-12SFG363C is a Virtex®-4 LX field programmable gate array (FPGA) from AMD, delivered in a 363-FBGA (17×17) surface-mount package. It provides a configurable hardware platform for custom digital logic implementations.

This commercial-grade device offers 24,192 logic elements, approximately 1.33 Mbits of embedded memory, and up to 240 user I/O, operating from a core supply range of 1.14 V to 1.26 V and a temperature range of 0 °C to 85 °C. The part is RoHS compliant.

Key Features

  • Core Logic  Provides 24,192 logic elements for implementation of custom digital designs and complex logic functions.
  • Embedded Memory  Approximately 1.33 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage for implemented logic.
  • I/O Resources  Up to 240 user I/O pins to interface with peripherals, memory, and external logic devices.
  • Power  Core supply voltage range of 1.14 V to 1.26 V for device operation.
  • Package & Mounting  363-FBGA (17×17) FCBGA package in a surface-mount format for compact board-level integration.
  • Operating Range  Commercial-grade temperature rating from 0 °C to 85 °C suitable for standard commercial applications.
  • Compliance  RoHS compliant for reduced hazardous substances in manufacturing and assembly.

Unique Advantages

  • High logic capacity: 24,192 logic elements enable sizeable custom logic implementations without external ASICs.
  • Substantial on-chip memory: Approximately 1.33 Mbits of embedded RAM reduces dependence on external memory for many designs.
  • Generous I/O complement: 240 user I/O pins simplify interfacing to multiple peripherals and parallel buses.
  • Compact surface-mount package: 363-FBGA (17×17) FCBGA combines high density with a package suitable for modern PCB designs.
  • Commercial temperature rating: 0 °C to 85 °C aligns the device with a wide range of standard commercial applications.
  • RoHS compliant: Supports product development with reduced hazardous substances considerations.

Why Choose XC4VLX25-12SFG363C?

The XC4VLX25-12SFG363C positions itself as a robust Virtex-4 LX FPGA option for designers requiring substantial logic density, on-chip memory, and a high I/O count in a compact 363-FBGA package. Its specified core voltage range and commercial temperature rating make it suitable for a variety of standard commercial electronic designs.

With AMD platform support and RoHS compliance, the device provides a scalable and integrable hardware building block for development, prototyping, and production deployments that match the listed electrical, thermal, and package specifications.

Request a quote or submit a pricing request to evaluate the XC4VLX25-12SFG363C for your next design project.

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