XC4VLX25-12SFG363C
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 1327104 24192 363-FBGA, FCBGA |
|---|---|
| Quantity | 1,677 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 363-FCBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 363-FBGA, FCBGA | Number of I/O | 240 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2688 | Number of Logic Elements/Cells | 24192 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1327104 |
Overview of XC4VLX25-12SFG363C – Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 1327104 24192 363-FBGA, FCBGA
The XC4VLX25-12SFG363C is a Virtex®-4 LX field programmable gate array (FPGA) from AMD, delivered in a 363-FBGA (17×17) surface-mount package. It provides a configurable hardware platform for custom digital logic implementations.
This commercial-grade device offers 24,192 logic elements, approximately 1.33 Mbits of embedded memory, and up to 240 user I/O, operating from a core supply range of 1.14 V to 1.26 V and a temperature range of 0 °C to 85 °C. The part is RoHS compliant.
Key Features
- Core Logic Provides 24,192 logic elements for implementation of custom digital designs and complex logic functions.
- Embedded Memory Approximately 1.33 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage for implemented logic.
- I/O Resources Up to 240 user I/O pins to interface with peripherals, memory, and external logic devices.
- Power Core supply voltage range of 1.14 V to 1.26 V for device operation.
- Package & Mounting 363-FBGA (17×17) FCBGA package in a surface-mount format for compact board-level integration.
- Operating Range Commercial-grade temperature rating from 0 °C to 85 °C suitable for standard commercial applications.
- Compliance RoHS compliant for reduced hazardous substances in manufacturing and assembly.
Unique Advantages
- High logic capacity: 24,192 logic elements enable sizeable custom logic implementations without external ASICs.
- Substantial on-chip memory: Approximately 1.33 Mbits of embedded RAM reduces dependence on external memory for many designs.
- Generous I/O complement: 240 user I/O pins simplify interfacing to multiple peripherals and parallel buses.
- Compact surface-mount package: 363-FBGA (17×17) FCBGA combines high density with a package suitable for modern PCB designs.
- Commercial temperature rating: 0 °C to 85 °C aligns the device with a wide range of standard commercial applications.
- RoHS compliant: Supports product development with reduced hazardous substances considerations.
Why Choose XC4VLX25-12SFG363C?
The XC4VLX25-12SFG363C positions itself as a robust Virtex-4 LX FPGA option for designers requiring substantial logic density, on-chip memory, and a high I/O count in a compact 363-FBGA package. Its specified core voltage range and commercial temperature rating make it suitable for a variety of standard commercial electronic designs.
With AMD platform support and RoHS compliance, the device provides a scalable and integrable hardware building block for development, prototyping, and production deployments that match the listed electrical, thermal, and package specifications.
Request a quote or submit a pricing request to evaluate the XC4VLX25-12SFG363C for your next design project.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








