XC4VLX25-12FFG676C

The XC4VLX25-12FFG676C is a Virtex®-4 LX FPGA from AMD delivered in a 676-ball FCBGA package. It provides substantial on-chip logic capacity and embedded RAM for commercial embedded designs.

Key on-device resources include 24,192 logic elements, approximately 1.33 Mbits of embedded memory, and 448 user I/O pins, while operating over a 1.14 V to 1.26 V supply range and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  24,192 logic elements available on-chip to implement combinational and sequential logic functions.
• Embedded Memory  Approximately 1.33 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage.
• I/O Density  Up to 448 user I/O pins, enabling high pin-count interfacing and multi-domain connectivity.
• Power Domain  Specified core supply range from 1.14 V to 1.26 V to match board power deliverables.
• Package & Mounting  Supplied in a 676-BBGA FCBGA package (supplier package: 676-FCBGA, 27 × 27 mm) for surface-mount assembly.
• Operating Range  Commercial-grade operation across 0 °C to 85 °C for standard embedded and commercial applications.
• Environmental Compliance  RoHS compliant construction for regulatory conformance in lead-free designs.

Unique Advantages

• Significant logic resources: 24,192 logic elements provide capacity for medium-scale FPGA designs without adding external logic.
• Substantial on-chip RAM: Approximately 1.33 Mbits of embedded memory reduces reliance on external memory for buffering and temporary storage.
• High I/O count: 448 I/O pins support complex board-level interfacing and multiple parallel interfaces.
• Compact, board-ready package: 676-FCBGA (27 × 27 mm) surface-mount package simplifies placement in dense PCB layouts.
• Commercial temperature rating: Guaranteed operation across 0 °C to 85 °C for standard commercial deployments.
• RoHS compliant: Meets lead-free process requirements for modern manufacturing practices.

Why Choose XC4VLX25-12FFG676C?

The XC4VLX25-12FFG676C delivers a balanced combination of logic density, embedded memory, and high I/O count in a compact 676-ball FCBGA package, making it suitable for commercial embedded projects that require significant on-chip resources. Its specified supply and temperature ranges provide clear integration parameters for board and power designers.

Backed by AMD as the manufacturer, this Virtex®-4 LX device is positioned for customers seeking a commercially graded FPGA with measurable on-chip capacity and RoHS-compliant packaging for mainstream production environments.

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