XC4VLX25-11SFG363I

The XC4VLX25-11SFG363I is a Virtex®-4 LX field programmable gate array (FPGA) from AMD, supplied in a 363-FCBGA surface-mount package. It delivers programmable logic, embedded memory and a high I/O count intended for industrial applications that require configurable digital logic in a compact footprint.

This device combines 24,192 logic elements and approximately 1.3 Mbits of on-chip RAM with a 240-pin I/O capability and an industrial operating temperature range, enabling custom digital designs with robust environmental tolerance.

Key Features

• Logic Capacity  2,688 configurable logic blocks (CLBs) delivering 24,192 logic elements for implementing custom digital functions.
• Embedded Memory  Approximately 1.3 Mbits of on-chip RAM to support data buffering, state machines and microcoded functions within the FPGA fabric.
• I/O Resources  240 general-purpose I/O pins to interface with sensors, peripherals, buses and external devices.
• Power and Core Voltage  Core supply range of 1.14 V to 1.26 V for device operation.
• Package and Mounting  363-FCBGA (17×17) package in a surface-mount form factor for high-density board designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Regulatory Compliance  RoHS compliant for environmental conformance.

Typical Applications

• Industrial Control Systems  Implement custom control logic, signal processing and interface bridging using the device's logic elements, on-chip RAM and 240 I/Os within an industrial temperature envelope.
• Embedded System Integration  Use the FPGA to integrate peripheral functions, glue logic and custom accelerators in compact, surface-mount designs.
• High‑Density I/O Interfaces  Deploy the device where multiple parallel or multi-protocol I/O channels are required, leveraging the 240 I/O pins for direct connectivity.

Unique Advantages

• Significant Logic Resources: 24,192 logic elements support complex programmable logic and moderate-scale designs without external CPLDs or discrete glue logic.
• On‑Chip Memory: Approximately 1.3 Mbits of embedded RAM reduces the need for external memory for buffering and local data storage.
• High I/O Count: 240 I/Os provide flexibility for interfacing multiple peripherals and high‑pin-count buses directly to the FPGA.
• Industrial Temperature Rating: −40 °C to 100 °C operation enables deployment in harsher environments where temperature resilience is required.
• Compact BGA Package: 363-FCBGA (17×17) delivers high integration density in a surface-mount form factor suitable for space-constrained PCBs.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose XC4VLX25-11SFG363I?

The XC4VLX25-11SFG363I positions itself as a versatile programmable logic device offering a balance of logic capacity, embedded memory and extensive I/O in a compact 363‑FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for deployments where environmental robustness and regulatory conformance matter.

Designers targeting embedded and industrial applications will find this FPGA useful for consolidating custom logic, interfacing multiple peripherals and implementing on-chip buffering, all within a surface-mount, high-density package.

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