XC4VLX25-11FFG676I

The XC4VLX25-11FFG676I is a Virtex-4 LX Field Programmable Gate Array (FPGA) IC from AMD offered in a 676-ball FCBGA package. It provides a programmable logic platform with substantial logic capacity, on-chip memory, and a high I/O count for industrial-class designs.

Key architectural characteristics include 24,192 logic elements, approximately 1.33 Mbits of embedded memory, and up to 448 I/O pins, making this device suitable for systems that require dense, reconfigurable logic and broad external connectivity within an industrial temperature range.

Key Features

• Core Logic  Contains 24,192 logic elements to implement custom digital functions and complex logic structures.
• Embedded Memory  Approximately 1.33 Mbits of on-chip RAM to support buffering, local storage, and state retention for implemented logic.
• I/O Capacity  Up to 448 I/O pins provide extensive external connectivity for interfaces, peripherals, and parallel buses.
• Power  Specified supply voltage range of 1.14 V to 1.26 V for core operation.
• Package & Mounting  Delivered in a 676-ball FCBGA (27 × 27) package; surface-mount mounting for compact board-level integration.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial control and automation  Use the FPGA’s programmable logic and industrial temperature rating to implement custom control algorithms, sequencing, and I/O aggregation in factory or process environments.
• High-density I/O systems  Leverage 448 I/O pins for designs requiring many external connections such as data acquisition front ends, switch fabric interfaces, or instrumentation panels.
• Embedded processing and buffering  Embedded memory (≈1.33 Mbits) supports on-chip buffering and state storage for custom packet processing, data staging, or local lookup tables.
• Board-level integration  The 676-FCBGA package enables compact integration of significant programmable logic into space-constrained industrial PCBs.

Unique Advantages

• Substantial programmable capacity: 24,192 logic elements provide the room to implement sizeable custom logic functions without external ASICs.
• On-chip memory for localized data handling: Approximately 1.33 Mbits of embedded RAM reduce reliance on external memory for buffering and state machines.
• Large I/O complement: 448 available I/Os simplify connectivity to numerous peripherals and high-pin-count interfaces on a single device.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in harsher environments where temperature resilience matters.
• Compact ball-grid packaging: The 676-FCBGA (27 × 27) package enables dense board layouts and surface-mount assembly for modern embedded systems.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC4VLX25-11FFG676I?

The XC4VLX25-11FFG676I combines a high count of logic elements, substantial embedded memory, and a broad I/O set in an industrial-grade FCBGA package. These attributes make it a practical choice for designers who need flexible, reconfigurable logic and reliable operation across a wide temperature range.

This device is positioned for applications that require on-board programmability, significant I/O connectivity, and compact package integration. Its specifications support long-lived deployments where programmable logic density and industrial temperature capability are important considerations.

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