XC4VLX25-11FFG668C

IC 448 1327104 24192 668-BBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 448 1327104 24192 668-BBGA, FCBGA

Quantity 131 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package668-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case668-BBGA, FCBGANumber of I/O448Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1327104

Overview of XC4VLX25-11FFG668C – Virtex-4 LX FPGA, 668-FCBGA (27×27)

The XC4VLX25-11FFG668C is a Virtex®-4 LX field programmable gate array (FPGA) from AMD, delivered in a 668-ball FCBGA package. It offers substantial on-chip resources including 24,192 logic elements, approximately 1.33 Mbits of embedded memory, and 448 I/O connections.

Targeted to commercial-grade designs, this device provides a combination of logic capacity, memory, and I/O density in a surface-mount 668-FCBGA (27×27) package, with RoHS compliance and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic  Provides 24,192 logic elements to implement programmable logic and custom digital functions.
  • Embedded Memory  Approximately 1.33 Mbits of on-chip RAM for buffering, packet storage, and local data processing.
  • I/O Density  448 general-purpose I/O pins to support multiple parallel interfaces and high-pin-count designs.
  • Power  Core supply voltage specified at 1.14 V to 1.26 V for precise power delivery and system design integration.
  • Package & Mounting  668-ball FCBGA (27×27) package, surface-mount mounting type for compact board-level integration.
  • Temperature & Grade  Commercial grade operation across 0 °C to 85 °C, suited for standard commercial electronic environments.
  • Environmental Compliance  RoHS compliant to meet common regulatory requirements for lead-free assembly.

Unique Advantages

  • Substantial logic capacity: 24,192 logic elements enable complex digital designs without external programmable logic expansion.
  • Ample on-chip RAM: Approximately 1.33 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
  • High I/O count: 448 I/O pins support dense interface requirements and facilitate multiple parallel connections.
  • Compact FCBGA footprint: 668-ball FCBGA (27×27) package offers a high resource-to-board-area ratio for space-constrained designs.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching typical commercial deployment environments.
  • RoHS compliant: Supports lead-free manufacturing processes and regulatory compliance.

Why Choose XC4VLX25-11FFG668C?

The XC4VLX25-11FFG668C combines a large pool of programmable logic, significant embedded memory, and a high I/O count within a compact 668-FCBGA package, making it appropriate for commercial designs that require on-chip resources and dense board-level integration. Its defined core voltage range and commercial operating temperature make system-level power and thermal planning straightforward.

This device is suitable for designers and procurement teams looking for a Virtex-4 LX family FPGA with verified resource counts and RoHS compliance, offering a balance of logic capacity, memory, and I/O in a surface-mount FCBGA package.

Request a quote or submit a purchase inquiry to receive pricing and availability for the XC4VLX25-11FFG668C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up