XC4VLX25-11FFG668C
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 448 1327104 24192 668-BBGA, FCBGA |
|---|---|
| Quantity | 131 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 668-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 668-BBGA, FCBGA | Number of I/O | 448 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 2688 | Number of Logic Elements/Cells | 24192 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1327104 |
Overview of XC4VLX25-11FFG668C – Virtex-4 LX FPGA, 668-FCBGA (27×27)
The XC4VLX25-11FFG668C is a Virtex®-4 LX field programmable gate array (FPGA) from AMD, delivered in a 668-ball FCBGA package. It offers substantial on-chip resources including 24,192 logic elements, approximately 1.33 Mbits of embedded memory, and 448 I/O connections.
Targeted to commercial-grade designs, this device provides a combination of logic capacity, memory, and I/O density in a surface-mount 668-FCBGA (27×27) package, with RoHS compliance and an operating temperature range of 0 °C to 85 °C.
Key Features
- Core Logic Provides 24,192 logic elements to implement programmable logic and custom digital functions.
- Embedded Memory Approximately 1.33 Mbits of on-chip RAM for buffering, packet storage, and local data processing.
- I/O Density 448 general-purpose I/O pins to support multiple parallel interfaces and high-pin-count designs.
- Power Core supply voltage specified at 1.14 V to 1.26 V for precise power delivery and system design integration.
- Package & Mounting 668-ball FCBGA (27×27) package, surface-mount mounting type for compact board-level integration.
- Temperature & Grade Commercial grade operation across 0 °C to 85 °C, suited for standard commercial electronic environments.
- Environmental Compliance RoHS compliant to meet common regulatory requirements for lead-free assembly.
Unique Advantages
- Substantial logic capacity: 24,192 logic elements enable complex digital designs without external programmable logic expansion.
- Ample on-chip RAM: Approximately 1.33 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
- High I/O count: 448 I/O pins support dense interface requirements and facilitate multiple parallel connections.
- Compact FCBGA footprint: 668-ball FCBGA (27×27) package offers a high resource-to-board-area ratio for space-constrained designs.
- Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching typical commercial deployment environments.
- RoHS compliant: Supports lead-free manufacturing processes and regulatory compliance.
Why Choose XC4VLX25-11FFG668C?
The XC4VLX25-11FFG668C combines a large pool of programmable logic, significant embedded memory, and a high I/O count within a compact 668-FCBGA package, making it appropriate for commercial designs that require on-chip resources and dense board-level integration. Its defined core voltage range and commercial operating temperature make system-level power and thermal planning straightforward.
This device is suitable for designers and procurement teams looking for a Virtex-4 LX family FPGA with verified resource counts and RoHS compliance, offering a balance of logic capacity, memory, and I/O in a surface-mount FCBGA package.
Request a quote or submit a purchase inquiry to receive pricing and availability for the XC4VLX25-11FFG668C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








