XC4VLX25-11FF668I
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 448 1327104 24192 668-BBGA, FCBGA |
|---|---|
| Quantity | 1,988 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 668-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 668-BBGA, FCBGA | Number of I/O | 448 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2688 | Number of Logic Elements/Cells | 24192 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1327104 |
Overview of XC4VLX25-11FF668I – Virtex®-4 LX FPGA, 24,192 logic elements, 668-FCBGA
The XC4VLX25-11FF668I is a Virtex®-4 LX field programmable gate array (FPGA) IC from AMD, offered in a 668-ball FCBGA package. This industrial-grade programmable logic device provides significant logic capacity, embedded RAM, and a high I/O count for demanding embedded and control-oriented designs.
With a core supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, the device is specified for applications that require sustained operation in industrial environments while maintaining a compact, surface-mount package footprint.
Key Features
- Logic Capacity — 24,192 logic elements to implement complex digital functions and custom hardware accelerators.
- Embedded Memory — Approximately 1.33 Mbits of on-chip RAM to support buffering, buffering-intensive pipelines, and data storage close to logic.
- I/O Density — 448 I/O resources for extensive peripheral interfacing and high-pin-count system connectivity.
- Package and Mounting — 668-BBGA (668-FCBGA, 27×27) surface-mount package for a compact, high-density board-level solution.
- Power — Core supply range of 1.14 V to 1.26 V to match system power architectures requiring precision core voltage.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to support industrial deployment conditions.
- RoHS Compliance — Environmentally compliant for lead-free manufacturing processes.
Typical Applications
- Industrial Control — Implement custom control logic, state machines, and deterministic I/O handling for automation and process control systems.
- Embedded Systems — Integrate application-specific hardware accelerators and peripheral interfaces within compact embedded platforms.
- High-Density I/O Systems — Support boards and modules requiring many external interfaces and signal routing with 448 available I/O resources.
Unique Advantages
- High Logic Integration: 24,192 logic elements enable consolidation of multiple functions into a single programmable device, reducing board-level component count.
- On-Chip Memory Close to Logic: Approximately 1.33 Mbits of embedded RAM minimizes external memory dependencies and reduces latency for data-intensive tasks.
- Significant I/O Capability: 448 I/O points provide flexibility for diverse peripheral and subsystem connections.
- Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
- Compact, Surface-Mount Package: 668-FCBGA (27×27) package delivers high density in a board-friendly surface-mount form factor.
- Regulatory Compatibility: RoHS compliance supports lead-free manufacturing and environmental requirements.
Why Choose XC4VLX25-11FF668I?
The XC4VLX25-11FF668I combines substantial logic capacity, embedded memory, and a large I/O complement in a compact 668-FCBGA surface-mount package, positioned for industrial applications that require programmable, reliable hardware. Its specified core voltage range and extended temperature rating make it suitable for designs where stability and environmental tolerance matter.
Designers looking to consolidate functions into a single FPGA for reduced BOM, tighter integration, and scalable hardware customization will find this Virtex®-4 LX device aligns with those needs while maintaining compliance with lead-free assembly practices.
Request a quote or submit an inquiry to obtain pricing, availability, and support for the XC4VLX25-11FF668I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








