XC4VLX25-10SF363I

The XC4VLX25-10SF363I is a Virtex®-4 LX Field Programmable Gate Array (FPGA) IC from AMD packaged in a 363-FBGA (17×17) surface-mount package. It provides programmable logic resources and I/O capacity for custom digital designs.

With 24,192 logic elements, approximately 1.33 Mbits of embedded memory and 240 I/O pins, this industrial-grade device supports designs that require moderate on-chip memory, flexible interfacing and extended temperature operation (−40 °C to 100 °C). The device operates from a core voltage supply range of 1.14 V to 1.26 V and is RoHS compliant.

Key Features

• Logic Capacity  24,192 logic elements for implementing complex custom digital functions and control logic.
• Embedded Memory  Approximately 1.33 Mbits of on-chip RAM to support buffering, state storage and local data processing without immediate dependence on external memory.
• I/O Count  240 programmable I/O pins to interface with peripherals, sensors and system buses.
• Package  363-FBGA (17×17) surface-mount ball-grid array (supplier device package: 363-FCBGA) for compact board integration.
• Power  Core voltage supply range of 1.14 V to 1.26 V for consistent device operation.
• Temperature & Grade  Industrial grade operation across −40 °C to 100 °C for use in extended-temperature environments.
• Compliance & Mounting  RoHS compliant and designed for surface-mount PCB assembly.

Typical Applications

• Industrial Control  Programmable control logic and I/O aggregation in industrial systems where extended temperature operation and robust interfacing are required.
• Embedded Systems & Prototyping  Custom digital logic implementation and hardware prototyping that leverage on-chip memory and flexible I/O.
• Communications & Interface Bridging  Protocol adaptation, interface logic and custom packet handling using available logic and I/O resources.
• Test & Measurement  Custom processing and I/O handling in instrumentation and test equipment that benefit from integrated memory and high I/O count.

Unique Advantages

• High Logic Density: 24,192 logic elements support substantial custom logic integration on a single device, reducing board-level complexity.
• Integrated On-chip Memory: Approximately 1.33 Mbits of embedded RAM lowers reliance on external memory for many buffering and state-storage needs.
• Extensive I/O: 240 I/O pins enable flexible connection to sensors, peripherals and external memory interfaces without immediate need for expansion logic.
• Industrial Temperature Rating: Rated for −40 °C to 100 °C, suitable for designs that require extended-temperature operation.
• Compact BGA Package: 363-FBGA (17×17) balances device density and PCB integration for space-constrained applications.
• RoHS Compliant: Meets RoHS requirements for environmentally regulated assemblies.

Why Choose XC4VLX25-10SF363I?

The XC4VLX25-10SF363I delivers a balanced combination of programmable logic capacity, on-chip memory and a high I/O count in a compact 363-FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for engineers designing robust systems that need reliable programmable logic and flexible interfacing.

Designed and manufactured by AMD, this Virtex®-4 LX FPGA is appropriate for development teams and integrators who require moderate logic density, embedded memory and abundant I/O in a surface-mount device. Its specification set supports scalable hardware designs where integration and environmental robustness matter.

Request a quote to check pricing and availability or to discuss how the XC4VLX25-10SF363I can fit your next design.