XC4VLX25-10FFG668I

The XC4VLX25-10FFG668I is a Virtex‑4 LX field programmable gate array (FPGA) from AMD provided in a 668‑ball FCBGA package. It offers a dense fabric of programmable logic and on‑chip memory for applications that require configurable digital logic, broad I/O connectivity and operation across an industrial temperature range.

Key Features

• Logic Capacity  Provides 24,192 logic elements to implement complex custom logic, control functions and datapaths.
• Logic Blocks  Includes 2,688 configurable logic blocks (CLBs) to structure and partition designs efficiently.
• Embedded Memory  Approximately 1.33 Mbits of on‑chip RAM to support buffering, lookup tables and small embedded data stores without external memory.
• High I/O Count  448 I/O pins for broad peripheral and bus interfacing options directly from the device package.
• Power Supply  Operates from a core supply range of 1.14 V to 1.26 V to match system power domains.
• Package & Mounting  668‑FCBGA (27×27) package in a surface‑mount form factor for high‑density board designs.
• Industrial Grade  Specified for operation from −40 °C to 100 °C and supplied as an industrial‑grade device.
• RoHS Compliant  Meets RoHS requirements for lead‑free assembly and regulatory compliance in applicable regions.

Typical Applications

• Embedded Processing  Implement custom datapaths, hardware accelerators or control logic using the device's large logic fabric and embedded RAM.
• High‑Density I/O Interfaces  Use the 448 I/O pins to bridge multiple peripherals, buses or front‑panel connections in compact systems.
• Prototyping & Development  Leverage the reprogrammable logic resources to iterate hardware designs and validate system architectures before final implementation.

Unique Advantages

• Significant Logic Resources: 24,192 logic elements enable substantial on‑chip functionality without immediate reliance on external ASICs.
• Integrated Memory Capacity: Approximately 1.33 Mbits of embedded RAM reduces the need for external memory for many buffering and LUT use cases.
• High I/O Density: 448 I/Os simplify board-level routing for multi‑interface designs and reduce the need for external I/O expanders.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in temperature‑variable environments.
• Compact, Surface‑Mount Package: 668‑FCBGA (27×27) allows high‑pin‑count integration in space-constrained PCB layouts.
• RoHS Compliance: Facilitates lead‑free assembly and supports regulatory requirements in applicable regions.

Why Choose XC4VLX25-10FFG668I?

The XC4VLX25-10FFG668I positions itself as a capable Virtex‑4 LX FPGA option for designers who need substantial programmable logic, embedded memory and high I/O in a single industrial‑grade device. Its combination of 24,192 logic elements, roughly 1.33 Mbits of on‑chip RAM and 448 I/Os makes it suited to systems that balance compute density with board‑level connectivity.

With a 668‑ball FCBGA package and surface‑mount mounting, this device supports dense, manufacturable board designs while the specified core voltage range and −40 °C to 100 °C operating window provide predictable electrical and thermal boundaries for system integration.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the XC4VLX25-10FFG668I.