XC4VLX25-10FFG668C

The XC4VLX25-10FFG668C is a Virtex®-4 LX Field Programmable Gate Array (FPGA) from AMD offered in a 668-ball FCBGA package. It provides a balanced combination of programmable logic resources, on-chip memory, and a high I/O count for commercial-grade electronic designs.

Designed for surface-mount board integration, this commercial-grade FPGA operates across a 1.14 V to 1.26 V supply range and an operating temperature range of 0 °C to 85 °C, with RoHS compliance for regulatory alignment.

Key Features

• Logic Capacity — Contains 2,688 CLBs and 24,192 logic elements for implementing custom digital logic and state machines.
• Embedded Memory — Approximately 1.33 Mbits (1,327,104 bits) of on-chip RAM to support buffers, FIFOs, and local data storage.
• High I/O Count — 448 user I/O pins to accommodate multiple external interfaces and parallel connections.
• Package and Mounting — 668-FCBGA (27×27) ball-grid array in a 668-BBGA/FCBGA package, designed for surface-mount assembly.
• Power — Operates from a core voltage supply between 1.14 V and 1.26 V to meet system power requirements.
• Commercial Grade and Temperature — Rated for commercial operation with an ambient temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant for materials and manufacturing process considerations.

Typical Applications

• Commercial Embedded Systems — Suitable for implementing custom logic and control functions in commercial electronic products where commercial-grade temperature range is required.
• High‑I/O Interface Modules — With 448 I/O pins, it supports designs requiring extensive external connectivity and parallel interfacing.
• On‑Chip Data Handling — Approximately 1.33 Mbits of embedded RAM enable local buffering, temporary storage, and data flow control within system logic.

Unique Advantages

• Substantial Logic Resources: 2,688 CLBs and 24,192 logic elements allow complex logic integration on a single device, reducing external glue logic.
• Significant Embedded Memory: Approximately 1.33 Mbits of on-chip RAM lowers dependence on external memory for many control and buffering tasks.
• Extensive Connectivity: 448 I/O pins provide flexibility for multi‑interface designs and high fan‑out applications.
• Compact, Surface‑Mount Package: 668-FCBGA (27×27) package supports dense board layouts and modern assembly processes.
• Commercial Temperature and RoHS Compliance: Rated 0 °C to 85 °C and RoHS compliant for deployment in commercial product lines.

Why Choose XC4VLX25-10FFG668C?

The XC4VLX25-10FFG668C positions itself as a commercially graded Virtex‑4 LX FPGA that combines a sizable logic fabric, meaningful embedded memory, and a high number of user I/Os in a compact 668‑ball FCBGA package. Its nominal core voltage range and commercial temperature rating make it appropriate for a wide range of board‑level designs that require on-chip programmability and integration.

For designers and procurement teams seeking a programmable logic device with clear, verifiable on-chip resources and standard surface‑mount packaging, this part delivers a practical balance of logic capacity, memory, and connectivity within the Virtex‑4 LX family.

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