XC4VLX25-10FFG676I

The XC4VLX25-10FFG676I is a Virtex®-4 LX Field Programmable Gate Array (FPGA) IC from AMD. It delivers a combination of logic capacity, embedded memory and I/O resources in a compact FCBGA package for surface-mount designs.

This device provides 24,192 logic elements, approximately 1.33 Mbits of embedded memory and 448 I/O pins. It operates from a 1.14 V to 1.26 V supply range and is specified for industrial temperature operation from -40 °C to 100 °C in a 676-FCBGA (27x27) package.

Key Features

• Logic Capacity  24,192 logic elements to implement medium-density digital designs and custom logic functions.
• Embedded Memory  Approximately 1.33 Mbits of on-chip RAM for buffering, state storage and intermediate data processing.
• I/O Resources  448 I/O pins to support broad interfacing requirements and multiple signal domains.
• Power Supply Range  Operates from 1.14 V to 1.26 V, enabling integration into low-voltage system architectures.
• Package and Mounting  676-FCBGA (27x27) package designed for surface-mount PCB assembly and compact board layouts.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C, suitable for temperature-sensitive deployments.
• Regulatory Compliance  RoHS compliant, meeting common environmental restrictions for electronic assemblies.

Typical Applications

• High-density logic designs  Use the FPGA where implementations require up to 24,192 logic elements and significant on-chip memory.
• I/O-intensive systems  Ideal for designs needing large numbers of external interfaces thanks to 448 available I/O pins.
• Embedded processing and buffering  Approximately 1.33 Mbits of embedded RAM supports data buffering, packet handling and temporary storage.

Unique Advantages

• High logic and memory integration: Combines 24,192 logic elements with approximately 1.33 Mbits of embedded RAM to reduce external component needs.
• Extensive I/O capability: 448 I/O pins enable connectivity to a wide range of peripherals and interfaces without additional I/O expanders.
• Industrial-grade thermal specification: Rated from -40 °C to 100 °C for deployments that require extended temperature operation.
• Compact FCBGA package: 676-FCBGA (27x27) format provides a space-efficient footprint for dense PCB designs.
• Low-voltage operation: 1.14 V to 1.26 V supply range supports modern low-voltage system designs.
• RoHS compliant: Meets environmental directives for lead-free assembly and materials.

Why Choose XC4VLX25-10FFG676I?

The XC4VLX25-10FFG676I positions itself as a mid-range Virtex-4 LX FPGA option from AMD, balancing logic density, embedded memory and extensive I/O in a single surface-mount FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for designs that require reliable operation across a wide temperature range while meeting environmental requirements.

This device is appropriate for engineers specifying FPGAs for systems that demand substantial logic resources, significant on-chip RAM and large I/O counts within a compact 676-FCBGA (27x27) footprint. Request a quote to evaluate pricing and availability for your next design cycle.

Request a quote today to obtain pricing and lead-time information for the XC4VLX25-10FFG676I.