XC4VLX25-10SFG363I

IC FPGA 240 I/O 363FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 1327104 24192 363-FBGA, FCBGA

Quantity 1 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package363-FCBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case363-FBGA, FCBGANumber of I/O240Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1327104

Overview of XC4VLX25-10SFG363I – Virtex®-4 LX FPGA, 363‑FBGA (Industrial)

The XC4VLX25-10SFG363I is a Virtex‑4 LX Field Programmable Gate Array (FPGA) IC supplied in a 363‑FBGA (17×17) package. It provides a balance of on‑chip logic resources, embedded memory, and I/O capacity for programmable digital designs.

Designed for industrial‑grade operation, the device supports a wide ambient temperature range and a defined core supply range, enabling deployment where robust environmental performance is required.

Key Features

  • Logic Capacity — 24,192 logic elements available for implementing user-defined digital logic functions.
  • Embedded Memory — Approximately 1.33 Mbits of on‑chip RAM to support buffering, state storage, and local data processing.
  • I/O — 240 user I/O pins for interfacing with peripherals, sensors, and external devices.
  • Package & Mounting — 363‑FBGA (17×17) package in a surface‑mount format for compact board layouts and high‑density placement.
  • Power — Core supply range from 1.14 V to 1.26 V for defined power integration and regulation design.
  • Operating Temperature — Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
  • Compliance — RoHS compliant for alignment with material restriction requirements.

Unique Advantages

  • Substantial Logic Resources: 24,192 logic elements provide the capacity to implement complex user logic without immediately moving to larger devices.
  • Integrated On‑Chip Memory: Approximately 1.33 Mbits of embedded RAM reduces the need for external memory in many buffering and stateful processing tasks.
  • High I/O Count: 240 I/O pins enable flexible interfacing and support for multiple parallel or serial connections.
  • Industrial‑Grade Temperature Range: Rated from −40 °C to 100 °C to support applications that require extended ambient performance.
  • Compact BGA Package: 363‑FBGA (17×17) supports dense PCB routing and efficient board area utilization.
  • Defined Power Envelope: Narrow core supply range (1.14 V–1.26 V) helps simplify power supply selection and regulation design.

Why Choose XC4VLX25-10SFG363I?

The XC4VLX25-10SFG363I combines Virtex‑4 LX FPGA architecture with a substantial complement of logic elements, embedded memory, and a high I/O count in an industrial‑rated package. Its package, power, and temperature specifications make it suitable for designs that require a stable, compact programmable logic solution.

This device is appropriate for engineers and teams seeking a defined set of programmable resources with industrial temperature capability and RoHS compliance, offering clear electrical and mechanical parameters for integration into production designs.

Request a quote or submit a pricing inquiry to receive availability and lead‑time information for the XC4VLX25-10SFG363I.

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