XC4VLX25-10SFG363I
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 1327104 24192 363-FBGA, FCBGA |
|---|---|
| Quantity | 1 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 363-FCBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 363-FBGA, FCBGA | Number of I/O | 240 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2688 | Number of Logic Elements/Cells | 24192 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1327104 |
Overview of XC4VLX25-10SFG363I – Virtex®-4 LX FPGA, 363‑FBGA (Industrial)
The XC4VLX25-10SFG363I is a Virtex‑4 LX Field Programmable Gate Array (FPGA) IC supplied in a 363‑FBGA (17×17) package. It provides a balance of on‑chip logic resources, embedded memory, and I/O capacity for programmable digital designs.
Designed for industrial‑grade operation, the device supports a wide ambient temperature range and a defined core supply range, enabling deployment where robust environmental performance is required.
Key Features
- Logic Capacity — 24,192 logic elements available for implementing user-defined digital logic functions.
- Embedded Memory — Approximately 1.33 Mbits of on‑chip RAM to support buffering, state storage, and local data processing.
- I/O — 240 user I/O pins for interfacing with peripherals, sensors, and external devices.
- Package & Mounting — 363‑FBGA (17×17) package in a surface‑mount format for compact board layouts and high‑density placement.
- Power — Core supply range from 1.14 V to 1.26 V for defined power integration and regulation design.
- Operating Temperature — Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
- Compliance — RoHS compliant for alignment with material restriction requirements.
Unique Advantages
- Substantial Logic Resources: 24,192 logic elements provide the capacity to implement complex user logic without immediately moving to larger devices.
- Integrated On‑Chip Memory: Approximately 1.33 Mbits of embedded RAM reduces the need for external memory in many buffering and stateful processing tasks.
- High I/O Count: 240 I/O pins enable flexible interfacing and support for multiple parallel or serial connections.
- Industrial‑Grade Temperature Range: Rated from −40 °C to 100 °C to support applications that require extended ambient performance.
- Compact BGA Package: 363‑FBGA (17×17) supports dense PCB routing and efficient board area utilization.
- Defined Power Envelope: Narrow core supply range (1.14 V–1.26 V) helps simplify power supply selection and regulation design.
Why Choose XC4VLX25-10SFG363I?
The XC4VLX25-10SFG363I combines Virtex‑4 LX FPGA architecture with a substantial complement of logic elements, embedded memory, and a high I/O count in an industrial‑rated package. Its package, power, and temperature specifications make it suitable for designs that require a stable, compact programmable logic solution.
This device is appropriate for engineers and teams seeking a defined set of programmable resources with industrial temperature capability and RoHS compliance, offering clear electrical and mechanical parameters for integration into production designs.
Request a quote or submit a pricing inquiry to receive availability and lead‑time information for the XC4VLX25-10SFG363I.

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