XC4VLX25-11FFG668I

The XC4VLX25-11FFG668I is a Virtex®-4 LX field-programmable gate array (FPGA) in a 668-ball FCBGA package, offered in an industrial-grade specification. It provides on-chip programmable logic and embedded memory suitable for custom digital designs that require a balance of logic capacity, I/O density, and industrial temperature operation.

Key Features

• Core Logic: 2,688 configurable logic blocks (CLBs) delivering 24,192 logic elements for implementing complex custom logic and state machines.
• Embedded Memory: Approximately 1.33 Mbits of on-chip RAM (1,327,104 total RAM bits) for buffering, FIFOs, and local data storage.
• I/O Density: 448 user I/O pins to support wide parallel interfaces, multiple peripherals, and extensive sensor or actuator connectivity.
• Power Supply: Core voltage supply range of 1.14 V to 1.26 V to match system power-rail design and regulator selection.
• Package & Mounting: 668-ball FCBGA (27 × 27 mm) surface-mount package offering a compact, high-pin-count solution for board-level integration.
• Temperature Range: Industrial operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance: RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Industrial Control Systems: Use the device's logic capacity and 448 I/O to implement motor control, PLC functions, and real-time supervisory logic within industrial temperature ranges.
• Signal Processing: Leverage the CLBs and on-chip RAM for custom data paths, buffering, and medium-scale digital signal processing tasks.
• High-Density I/O Interfaces: Implement multi-channel interfaces or bridge functions where large numbers of parallel I/O lines are required.
• Custom Embedded Systems: Deploy as the programmable logic backbone for customized embedded platforms that require field-upgradable logic and memory resources.

Unique Advantages

• Substantial Logic Capacity: 2,688 CLBs and 24,192 logic elements enable implementation of sizeable custom logic without external CPLDs or ASICs.
• Significant On-Chip Memory: Approximately 1.33 Mbits of embedded RAM reduces the need for external memory for many buffering and FIFO requirements.
• High Pin Count in a Compact Package: 668-ball FCBGA (27×27 mm) provides high I/O density while minimizing PCB footprint compared with multiple discrete devices.
• Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
• RoHS Compliant: Supports lead-free assembly processes for modern manufacturing requirements.

Why Choose XC4VLX25-11FFG668I?

The XC4VLX25-11FFG668I positions itself as a robust industrial-grade FPGA option that combines a substantial logic matrix, meaningful on-chip RAM, and a high I/O count in a space-efficient FCBGA package. It is suited for engineers and procurement teams building medium-complexity programmable systems that must operate across industrial temperature ranges.

With clear specification for core voltage, package, I/O, and memory resources, this device supports designs that need field-programmable flexibility, local buffering, and high connectivity while adhering to RoHS manufacturing requirements.

Request a quote or submit a procurement inquiry to evaluate the XC4VLX25-11FFG668I for your next industrial FPGA design.