XC4VLX25-11SF363C

The XC4VLX25-11SF363C is a commercial-grade Field Programmable Gate Array from AMD's Virtex‑4 LX family. It offers on-chip programmable logic and embedded memory in a compact 363‑FBGA (17×17) surface-mount package suitable for commercial electronic designs.

With approximately 24,192 logic elements, roughly 1.33 Mbits of embedded memory, and 240 user I/Os, this device addresses applications that require moderate logic capacity, substantial on-chip RAM, and a dense I/O footprint within a single FPGA package.

Key Features

• Programmable Logic Capacity — Approximately 24,192 logic elements providing flexible implementation of custom digital logic functions.
• Configurable Logic Blocks (CLBs) — Device architecture includes 2,688 CLBs to organize and map logic resources efficiently.
• Embedded Memory — Approximately 1.33 Mbits of on-chip RAM for buffering, FIFOs, and data storage without external memory.
• I/O Density — 240 user I/O pins to support multiple parallel interfaces and high-pin-count designs.
• Package & Mounting — 363‑FBGA (17×17) FCBGA package in a surface-mount format for compact board integration.
• Supply Voltage — Core voltage range of 1.14 V to 1.26 V to match system power-rail design requirements.
• Operating Range — Commercial temperature grade rated from 0 °C to 85 °C for typical commercial-environment deployments.
• RoHS Compliant — Complies with RoHS directives for reduced hazardous substances.

Typical Applications

• Commercial Embedded Systems — Implement custom logic and data-paths for commercial products that require programmable hardware in a compact package.
• Digital Signal Processing — Use the device’s logic and on-chip RAM for buffering and intermediate processing in DSP pipelines.
• High-Density I/O Control — Leverage 240 I/Os for multi-channel interfacing, parallel buses, and control-plane functions.

Unique Advantages

• Balance of Logic and Memory: About 24,192 logic elements paired with roughly 1.33 Mbits of embedded RAM supports both combinational and data-storage needs without immediate external memory.
• High I/O Count in a Compact Package: 240 I/Os in a 17×17 363‑FBGA footprint enables dense connectivity while minimizing board area.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for designs targeting standard commercial environments.
• RoHS Compliance: Meets environmental requirements for lead-free assembly and reduced hazardous substances.
• Predictable Power Envelope: Defined core supply voltage range of 1.14 V to 1.26 V simplifies power-supply design and thermal planning.

Why Choose XC4VLX25-11SF363C?

The XC4VLX25-11SF363C provides a straightforward combination of programmable logic density, on-chip memory, and high I/O count in a compact surface-mount FBGA package. Its commercial temperature rating and RoHS compliance make it appropriate for a wide range of commercial electronic products that require reliable, reprogrammable hardware resources.

This device is well suited to engineers and designers building commercial embedded systems, DSP implementations, or high‑I/O control applications who need a balance of logic elements, embedded RAM, and a compact footprint from a Virtex‑4 LX family FPGA.

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