XC4VLX25-11SFG363C

The XC4VLX25-11SFG363C is a Virtex®-4 LX Field Programmable Gate Array (FPGA) in a 363-ball FBGA package. It provides programmable logic resources, on-chip RAM and a large set of I/O pins in a surface-mount form factor for FPGA-based designs.

This commercial-grade device targets applications that require significant logic capacity, embedded memory and high I/O count within a compact 17 mm × 17 mm 363-FCBGA package.

Key Features

• Core Logic  2,688 CLBs and 24,192 logic elements provide the programmable logic resources for implementing custom digital circuits.
• Embedded Memory  Approximately 1.327 Mbits of on-chip RAM (1,327,104 bits) for buffering, state storage and local data processing.
• I/O Capacity  240 user I/O pins to support wide parallel interfaces and multiple signal connections.
• Power  Operates from a core voltage supply range of 1.14 V to 1.26 V.
• Package & Mounting  363-FBGA / 363-FCBGA (17×17) package with surface-mount mounting for compact board-level integration.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• FPGA-based system prototyping  Leverages the 24,192 logic elements and 2,688 CLBs to prototype and validate complex digital designs on a single device.
• Data buffering and local memory  Approximately 1.327 Mbits of embedded RAM enables on-chip data storage for packet buffering, FIFOs or scratch memory.
• High-density I/O interfaces  240 I/O pins support parallel data paths and multiple external interfaces for board-level integration.

Unique Advantages

• Substantial logic capacity: 2,688 CLBs and 24,192 logic elements provide room for sizable custom logic implementations without external logic expansion.
• On-chip RAM for local processing: Approximately 1.327 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• High I/O count in a compact package: 240 I/O pins in a 363-FCBGA (17×17) package enable dense interconnect while minimizing PCB footprint.
• Surface-mount package: FBGA form factor supports modern PCB assembly and compact system designs.
• Commercial operating range: Rated for 0 °C to 85 °C to match commercial-grade system requirements.
• RoHS compliant: Meets lead-free regulatory requirements for environmental compliance.

Why Choose XC4VLX25-11SFG363C?

The XC4VLX25-11SFG363C combines a Virtex-4 LX FPGA architecture with significant logic resources, embedded RAM and a high I/O count in a compact 363-FCBGA package. Its electrical and thermal specifications make it suitable for commercial designs that require on-chip memory, abundant logic and multiple external interfaces.

This part is well suited for designers and teams seeking a single-chip programmable solution that balances logic density, memory and I/O capacity while fitting into a surface-mount 17×17 FBGA footprint.

Request a quote or submit an inquiry to check pricing and availability for the XC4VLX25-11SFG363C. Our team will provide the information you need to move forward with procurement and integration.