XC4VLX25-11FFG676C

The XC4VLX25-11FFG676C is a Virtex®-4 LX field programmable gate array in a 676‑ball FCBGA package. It provides a balanced combination of configurable logic, embedded memory, and a high I/O count for commercial‑grade FPGA designs.

Designed for surface‑mount PCB assembly and operation across a commercial temperature range, this device targets applications that require sizable logic capacity, integrated RAM, and a broad I/O interface within a compact 27×27 mm package.

Key Features

• Configurable Logic — 2,688 CLBs providing 24,192 logic elements for implementing custom digital circuits and parallel processing architectures.
• Embedded Memory — Approximately 1.33 Mbits of on‑chip RAM to support buffering, FIFO structures, and small on‑chip data stores.
• High I/O Count — 448 user I/O pins to accommodate multiple interfaces, buses, and peripheral connections without external multiplexing.
• Power Supply — Operates from a core voltage range of 1.14 V to 1.26 V, enabling predictable power budgeting for the FPGA core.
• Package & Mounting — 676‑BBGA (676‑FCBGA) package in a 27×27 mm footprint, optimized for surface‑mount assembly on compact boards.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• Programmable Logic Integration — Implement custom logic functions, protocol bridging, and parallel processing tasks using the device’s CLBs and logic elements.
• Memory‑Assisted Data Paths — Use the on‑chip RAM for buffering and temporary storage in data flow and streaming applications.
• I/O‑Dense Systems — Support multiple external interfaces and peripherals with the device’s 448 I/O pins, reducing external glue logic.

Unique Advantages

• Substantial Logic Capacity: 2,688 CLBs and 24,192 logic elements provide headroom for complex custom designs without immediate up‑scaling.
• Integrated Embedded Memory: Approximately 1.33 Mbits of on‑chip RAM reduces reliance on external memory for mid‑size buffering needs.
• Extensive I/O Resources: 448 I/O pins simplify board-level integration of multiple buses and peripherals, minimizing external multiplexers.
• Compact FCBGA Package: 676‑ball FCBGA (27×27 mm) enables a dense component footprint while supporting surface‑mount assembly workflows.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial product deployments.

Why Choose XC4VLX25-11FFG676C?

The XC4VLX25-11FFG676C positions itself as a versatile commercial‑grade FPGA that combines meaningful logic density, embedded memory, and a high I/O count in a compact 676‑ball FCBGA package. Its electrical and thermal specifications make it suitable for designs that require on‑chip resources and broad interfacing capability within standard commercial operating conditions.

This part is well suited for development teams and procurement looking for a configurable logic device that supports substantial custom logic and mid‑level embedded memory while maintaining a compact PCB footprint and surface‑mount assembly compatibility.

Request a quote or submit a procurement inquiry to evaluate XC4VLX25-11FFG676C for your next design.