XC4VLX25-11SF363I

The XC4VLX25-11SF363I is a Field Programmable Gate Array (FPGA) IC from the Virtex®-4 LX family, provided in a 363-ball FCBGA package. It delivers a combination of programmable logic, embedded memory, and extensive I/O in a surface-mount footprint targeted at industrial designs.

With 24,192 logic elements, approximately 1.33 Mbits of on-chip RAM and up to 240 I/O, the device is suited to designs that require moderate logic capacity, significant embedded memory, and high pin count in a compact, robust package.

Key Features

• Logic Capacity — 2,688 CLBs supporting a total of 24,192 logic elements for implementing custom digital logic and control functions.
• Embedded Memory — Approximately 1.33 Mbits of on-chip RAM to support buffering, packet processing, and local data storage without external memory.
• I/O Density — Up to 240 user I/O pins to interface with sensors, peripherals, high-speed buses, and external devices.
• Power Supply — Core voltage specification of 1.14 V to 1.26 V to match system power-rail requirements.
• Package & Mounting — 363-FBGA (363-FCBGA) surface-mount package with a 17 × 17 mm footprint for compact PCB integration.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C suitable for extended-temperature deployments.
• Environmental Compliance — RoHS compliant to meet lead-free assembly and regulatory requirements.

Typical Applications

• Custom Digital Processing: Implement application-specific logic and state machines using the device's 24,192 logic elements and CLB resource.
• Memory-Intensive Embedded Tasks: Use approximately 1.33 Mbits of on-chip RAM for packet buffering, data queuing, or local algorithm storage without immediate reliance on external memory.
• High-Density I/O Systems: Leverage up to 240 I/O pins to connect to multiple peripherals, sensors, or external interfaces in compact industrial equipment.

Unique Advantages

• Balanced Logic and Memory: The combination of 24,192 logic elements and ~1.33 Mbits of RAM provides a versatile platform for mid-range FPGA designs that need both logic density and embedded storage.
• High I/O Count: Up to 240 I/Os enable broad connectivity options, reducing the need for external I/O expanders in multi-interface applications.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support reliably operating systems in extended-temperature environments.
• Compact FCBGA Packaging: The 363-FCBGA (17 × 17 mm) surface-mount package delivers a high-pin-count solution in a compact board footprint for dense system designs.
• Regulatory Compatibility: RoHS compliance simplifies integration into lead-free manufacturing flows and helps meet environmental requirements.

Why Choose XC4VLX25-11SF363I?

The XC4VLX25-11SF363I positions itself as a reliable mid-range FPGA choice where programmable logic, embedded memory, and high I/O count must coexist in a compact, industrial-grade package. Its combination of 24,192 logic elements, approximately 1.33 Mbits of on-chip RAM, and up to 240 I/O supports a wide range of custom digital designs that require robust operation across −40 °C to 100 °C.

This device is well suited to engineers and procurement teams building industrial systems that need a surface-mount FCBGA solution with measurable logic and memory resources, high I/O density, and RoHS compliance for lead-free production.

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