XC4VLX25-12FF668C

The XC4VLX25-12FF668C is a Virtex®-4 LX field programmable gate array (FPGA) manufactured by AMD. It provides a balanced combination of programmable logic, embedded memory, and a high count of general-purpose I/O in a 668-FCBGA package for board-level integration.

With 24,192 logic elements, approximately 1.3 Mbits of embedded memory, and 448 I/O pins, this commercial-grade FPGA targets designs that require medium-density logic capacity, substantial on-chip RAM, and dense I/O connectivity within a surface-mount 27×27 FCBGA footprint.

Key Features

• Programmable Logic Capacity  24,192 logic elements provide a sizable resource pool for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 1.3 Mbits of on-chip RAM for buffering, storage, and memory-mapped logic functions.
• High I/O Count  448 user I/O pins enable dense peripheral interfacing and complex bus connectivity.
• Package  668-ball FCBGA package (668-FCBGA, 27×27) supports compact, surface-mount board layouts.
• Power Supply  Core voltage range of 1.14 V to 1.26 V to match system power rails and design requirements.
• Operating Temperature  Commercial temperature rating from 0°C to 85°C suitable for standard ambient operating conditions.
• Mounting and Compliance  Surface-mount device with RoHS compliance for modern manufacturing processes.

Typical Applications

• Programmable logic and glue logic  Implement custom logic functions and interface glue using the device's 24,192 logic elements.
• Memory-backed processing  Use approximately 1.3 Mbits of embedded memory for buffering, FIFOs, and state storage in data-path designs.
• High-density I/O interfacing  448 I/O pins support complex peripheral and bus connections for multi-signal interfaces.
• Compact board-level integration  The 668-FCBGA (27×27) package and surface-mount mounting simplify placement in space-constrained PCB designs.

Unique Advantages

• Balanced logic and memory resources: 24,192 logic elements paired with ~1.3 Mbits of embedded RAM support a wide range of logic and buffering needs without external memory for many designs.
• Dense I/O capability: 448 I/O pins enable complex signal routing and multiple parallel interfaces, reducing the need for external multiplexing.
• Commercial temperature rating: Rated 0°C to 85°C for applications operating within standard environmental conditions.
• Compact FCBGA package: 668-ball (27×27) FCBGA supports surface-mount assembly for modern, compact PCB layouts.
• RoHS compliant: Meets lead-free manufacturing requirements for regulatory and process compatibility.

Why Choose XC4VLX25-12FF668C?

The XC4VLX25-12FF668C positions itself as a practical choice for designers needing a mid-range Virtex®-4 LX FPGA with a strong mix of logic density, embedded RAM, and high I/O count in a space-efficient FCBGA package. Its electrical and thermal ratings make it suitable for commercial electronic products requiring on-chip memory and substantial interfacing capability.

This part is well suited to engineers and teams developing board-level FPGA solutions that prioritize integrated memory and dense connectivity while maintaining a compact surface-mount footprint and RoHS compliance.

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