XC4VLX25-12SF363C
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 1327104 24192 363-FBGA, FCBGA |
|---|---|
| Quantity | 1,826 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 363-FCBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 363-FBGA, FCBGA | Number of I/O | 240 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2688 | Number of Logic Elements/Cells | 24192 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1327104 |
Overview of XC4VLX25-12SF363C – Virtex®-4 LX FPGA, 363-FBGA
The XC4VLX25-12SF363C is a Virtex-4 LX field programmable gate array (FPGA) in a 363-FBGA (17×17) surface-mount package. It provides a combination of logic capacity, on-chip RAM and I/O resources suited for commercial electronic designs requiring programmable digital logic integration.
Key Features
- Core Logic 2,688 CLBs and 24,192 logic elements provide the programmable fabric for custom digital logic implementation.
- Embedded Memory Approximately 1.33 Mbits of on-chip RAM for buffering, state storage and local data processing.
- I/O Integration 240 I/O pins to support a variety of external interfaces and system-level signal connectivity.
- Power Operating supply range of 1.14 V to 1.26 V consistent with the device's core voltage requirements.
- Package & Mounting 363-FBGA (17×17) supplier device package in a surface-mount footprint for compact board integration.
- Temperature & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- Balanced logic capacity: The combination of 2,688 CLBs and 24,192 logic elements supports mid-range programmable designs without excessive footprint.
- On-chip memory available: Approximately 1.33 Mbits of embedded RAM reduces dependence on external memory for common buffering and control tasks.
- High I/O count: 240 I/O pins allow extensive system interfacing and peripheral connectivity from a single device.
- Compact FBGA package: 363-FBGA (17×17) enables dense PCB placement while maintaining a surface-mount assembly flow.
- Commercial temperature suitability: Rated 0 °C to 85 °C to meet typical commercial product operating ranges.
- RoHS compliant: Meets common environmental requirements for lead-free assembly.
Why Choose XC4VLX25-12SF363C?
The XC4VLX25-12SF363C positions itself as a practical choice for commercial applications that need a mid-range FPGA with a defined balance of logic elements, embedded memory and a substantial I/O count in a compact 363-FBGA package. Its specified core voltage range and commercial temperature rating make it suitable for standard commercial electronic products.
This device is appropriate for designers and procurement teams seeking a programmable logic solution where on-chip RAM, a significant number of I/Os and a compact BGA footprint are primary selection criteria.
Request a quote or submit a parts inquiry to obtain pricing and availability for the XC4VLX25-12SF363C.
Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH
