XC4VLX25-12SF363C

IC FPGA 240 I/O 363FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 1327104 24192 363-FBGA, FCBGA

Quantity 1,669 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package363-FCBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case363-FBGA, FCBGANumber of I/O240Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1327104

Overview of XC4VLX25-12SF363C – Virtex®-4 LX FPGA, 363-FBGA

The XC4VLX25-12SF363C is a Virtex-4 LX field programmable gate array (FPGA) in a 363-FBGA (17×17) surface-mount package. It provides a combination of logic capacity, on-chip RAM and I/O resources suited for commercial electronic designs requiring programmable digital logic integration.

Key Features

  • Core Logic  2,688 CLBs and 24,192 logic elements provide the programmable fabric for custom digital logic implementation.
  • Embedded Memory  Approximately 1.33 Mbits of on-chip RAM for buffering, state storage and local data processing.
  • I/O Integration  240 I/O pins to support a variety of external interfaces and system-level signal connectivity.
  • Power  Operating supply range of 1.14 V to 1.26 V consistent with the device's core voltage requirements.
  • Package & Mounting  363-FBGA (17×17) supplier device package in a surface-mount footprint for compact board integration.
  • Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • Balanced logic capacity: The combination of 2,688 CLBs and 24,192 logic elements supports mid-range programmable designs without excessive footprint.
  • On-chip memory available: Approximately 1.33 Mbits of embedded RAM reduces dependence on external memory for common buffering and control tasks.
  • High I/O count: 240 I/O pins allow extensive system interfacing and peripheral connectivity from a single device.
  • Compact FBGA package: 363-FBGA (17×17) enables dense PCB placement while maintaining a surface-mount assembly flow.
  • Commercial temperature suitability: Rated 0 °C to 85 °C to meet typical commercial product operating ranges.
  • RoHS compliant: Meets common environmental requirements for lead-free assembly.

Why Choose XC4VLX25-12SF363C?

The XC4VLX25-12SF363C positions itself as a practical choice for commercial applications that need a mid-range FPGA with a defined balance of logic elements, embedded memory and a substantial I/O count in a compact 363-FBGA package. Its specified core voltage range and commercial temperature rating make it suitable for standard commercial electronic products.

This device is appropriate for designers and procurement teams seeking a programmable logic solution where on-chip RAM, a significant number of I/Os and a compact BGA footprint are primary selection criteria.

Request a quote or submit a parts inquiry to obtain pricing and availability for the XC4VLX25-12SF363C.

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