XC4VLX25-11FF668C

The XC4VLX25-11FF668C is a Virtex-4 LX field programmable gate array (FPGA) in a 668-ball FCBGA package. It delivers up to 24,192 logic elements and approximately 1.33 Mbits of embedded memory, supporting designs that require substantial on-chip logic capacity and embedded RAM.

With up to 448 I/Os, a 668-FCBGA (27×27) surface-mount package, RoHS compliance, a supply voltage range of 1.14 V to 1.26 V, and a commercial operating range of 0 °C to 85 °C, this device is specified for commercial-grade programmable logic applications where moderate temperature range and high I/O density are required.

Key Features

• Logic Capacity  Provides 24,192 logic elements to implement complex combinational and sequential logic functions.
• On-chip Memory  Approximately 1.33 Mbits of embedded memory for buffering, state storage, and data processing.
• I/O Density  Up to 448 I/Os to support multiple parallel interfaces and high pin-count systems.
• Package & Mounting  668-FCBGA (27×27) package in a surface-mount form factor for compact board-level integration.
• Power Supply  Specified supply voltage range of 1.14 V to 1.26 V to match system power rails and enable predictable power design.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Deploys where designs need up to 24,192 logic elements to realize custom digital functions on-chip.
• High I/O interface implementations  Supports applications requiring large numbers of external connections with up to 448 I/Os.
• Embedded memory buffering  Uses approximately 1.33 Mbits of on-chip RAM for data buffering, temporary storage, and state machines.

Unique Advantages

• Substantial logic resources: 24,192 logic elements provide the capacity to integrate complex logic blocks without external CPLDs.
• Significant embedded memory: Approximately 1.33 Mbits of on-chip RAM reduces reliance on external memory for many buffering and control tasks.
• High I/O count: 448 I/Os enable integration of multiple parallel interfaces and high-pin-count peripherals directly to the FPGA.
• Compact FCBGA packaging: 668-ball FCBGA (27×27) offers a high-density, surface-mount solution for space-constrained board designs.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly processes.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to match typical commercial applications.

Why Choose XC4VLX25-11FF668C?

The XC4VLX25-11FF668C positions itself as a commercial-grade, high-density FPGA option that combines sizable logic capacity, substantial embedded memory, and very high I/O count in a compact 668-FCBGA package. Its specified supply voltage range and RoHS compliance make it suitable for board-level designs that require predictable power characteristics and environmental compliance.

This device is well suited to development teams and procurement groups looking for a programmable logic component that supports complex on-chip logic, significant on-die RAM, and extensive external connectivity within a surface-mount FCBGA footprint and commercial operating range.

Request a quote or submit an inquiry for XC4VLX25-11FF668C to obtain pricing and availability details for your design needs.