XC4VLX25-10SFG363C
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 1327104 24192 363-FBGA, FCBGA |
|---|---|
| Quantity | 809 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 363-FCBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 363-FBGA, FCBGA | Number of I/O | 240 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2688 | Number of Logic Elements/Cells | 24192 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1327104 |
Overview of XC4VLX25-10SFG363C – Virtex®-4 LX Field Programmable Gate Array (FPGA) IC, 363-FBGA
The XC4VLX25-10SFG363C is a Virtex-4 LX Field Programmable Gate Array (FPGA) from AMD delivered in a 363-FBGA (17×17) surface-mount package. It is specified as a commercial-grade programmable logic device suitable for designs requiring on-chip logic density, embedded memory, and substantial I/O count.
This device provides approximately 24,192 logic elements, approximately 1.33 Mbits of embedded memory, and 240 user I/O pins. Supply and thermal parameters are defined for system integration: core voltage between 1.14 V and 1.26 V and an operating temperature range of 0 °C to 85 °C.
Key Features
- Core (Logic) Approximately 24,192 logic elements for implementing custom digital functions and control logic.
- Embedded Memory Total on-chip RAM bits: 1,327,104 — approximately 1.33 Mbits of embedded memory for buffering, state machines, and local data storage.
- I/O 240 user I/O pins to interface with external peripherals, buses, and I/O standards in board-level designs.
- Power Core voltage supply range of 1.14 V to 1.26 V for power supply planning and integration.
- Package & Mounting 363-FBGA (17×17) FCBGA package in a surface-mount form factor for PCB assembly.
- Operating Conditions & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- Substantial logic capacity: Approximately 24,192 logic elements provide room for complex finite-state machines, glue logic, and moderate-scale custom datapaths within a single device.
- On-chip memory for local storage: Approximately 1.33 Mbits of embedded RAM reduces dependence on external memory for buffering and small datasets.
- High I/O availability: 240 I/O pins support multiple external interfaces and simplify board-level connectivity without immediate need for I/O expanders.
- Compact BGA package: 363-FBGA (17×17) offers a compact surface-mount solution suitable for dense PCB layouts.
- Commercial-grade spec set: Defined operating temperature range (0 °C to 85 °C) and RoHS compliance align the device with commercial product requirements.
Why Choose XC4VLX25-10SFG363C?
The XC4VLX25-10SFG363C positions a Virtex-4 LX FPGA’s programmable logic and embedded memory in a compact 363-FBGA package for commercial applications. Its combination of approximately 24,192 logic elements, roughly 1.33 Mbits of on-chip RAM, and 240 I/O pins makes it suitable for designs that need significant on-chip resources while maintaining a surface-mount BGA footprint.
Manufactured by AMD and provided as a RoHS-compliant, commercial-grade device, it is appropriate for engineering teams and procurement focusing on scalable programmable logic capacity, on-chip memory utilization, and defined supply and thermal parameters for system integration.
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