XC4VLX25-10SFG363C

IC FPGA 240 I/O 363FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 1327104 24192 363-FBGA, FCBGA

Quantity 809 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package363-FCBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case363-FBGA, FCBGANumber of I/O240Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2688Number of Logic Elements/Cells24192
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1327104

Overview of XC4VLX25-10SFG363C – Virtex®-4 LX Field Programmable Gate Array (FPGA) IC, 363-FBGA

The XC4VLX25-10SFG363C is a Virtex-4 LX Field Programmable Gate Array (FPGA) from AMD delivered in a 363-FBGA (17×17) surface-mount package. It is specified as a commercial-grade programmable logic device suitable for designs requiring on-chip logic density, embedded memory, and substantial I/O count.

This device provides approximately 24,192 logic elements, approximately 1.33 Mbits of embedded memory, and 240 user I/O pins. Supply and thermal parameters are defined for system integration: core voltage between 1.14 V and 1.26 V and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core (Logic) Approximately 24,192 logic elements for implementing custom digital functions and control logic.
  • Embedded Memory Total on-chip RAM bits: 1,327,104 — approximately 1.33 Mbits of embedded memory for buffering, state machines, and local data storage.
  • I/O 240 user I/O pins to interface with external peripherals, buses, and I/O standards in board-level designs.
  • Power Core voltage supply range of 1.14 V to 1.26 V for power supply planning and integration.
  • Package & Mounting 363-FBGA (17×17) FCBGA package in a surface-mount form factor for PCB assembly.
  • Operating Conditions & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • Substantial logic capacity: Approximately 24,192 logic elements provide room for complex finite-state machines, glue logic, and moderate-scale custom datapaths within a single device.
  • On-chip memory for local storage: Approximately 1.33 Mbits of embedded RAM reduces dependence on external memory for buffering and small datasets.
  • High I/O availability: 240 I/O pins support multiple external interfaces and simplify board-level connectivity without immediate need for I/O expanders.
  • Compact BGA package: 363-FBGA (17×17) offers a compact surface-mount solution suitable for dense PCB layouts.
  • Commercial-grade spec set: Defined operating temperature range (0 °C to 85 °C) and RoHS compliance align the device with commercial product requirements.

Why Choose XC4VLX25-10SFG363C?

The XC4VLX25-10SFG363C positions a Virtex-4 LX FPGA’s programmable logic and embedded memory in a compact 363-FBGA package for commercial applications. Its combination of approximately 24,192 logic elements, roughly 1.33 Mbits of on-chip RAM, and 240 I/O pins makes it suitable for designs that need significant on-chip resources while maintaining a surface-mount BGA footprint.

Manufactured by AMD and provided as a RoHS-compliant, commercial-grade device, it is appropriate for engineering teams and procurement focusing on scalable programmable logic capacity, on-chip memory utilization, and defined supply and thermal parameters for system integration.

Request a quote or submit a quote for XC4VLX25-10SFG363C to check availability and pricing for your next design.

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