XC4VLX25-10FFG676C

The XC4VLX25-10FFG676C is a Virtex®-4 LX Field Programmable Gate Array (FPGA) IC from AMD. It delivers 24,192 logic elements and approximately 1.33 Mbits of embedded memory in a 676-FCBGA package.

With 448 general-purpose I/O pins, a supply voltage range of 1.14 V to 1.26 V, and a commercial operating temperature range of 0 °C to 85 °C, this device is specified for designs that require substantial programmable logic capacity and high I/O count in a surface-mount BGA footprint.

Key Features

• Logic Capacity  24,192 logic elements provide the device's core programmable logic resource for implementing custom digital functions.
• Embedded Memory  Approximately 1.33 Mbits (1,327,104 bits) of on-chip RAM to support buffering, FIFOs, and other memory-intensive logic blocks.
• High I/O Count  448 I/O pins for extensive external interfacing and parallel connectivity.
• Power and Voltage  Specified supply voltage range of 1.14 V to 1.26 V for core power planning.
• Package and Mounting  676-FCBGA (27×27) package, surface-mount mount type; package case listed as 676-BBGA, FCBGA.
• Operating Range  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Status  RoHS compliant.

Typical Applications

• Programmable Logic Systems  Use where discrete programmable logic capacity (24,192 logic elements) is required to implement custom digital architectures.
• High‑I/O Interfaces  Deploy in designs that need extensive external connectivity, leveraging the 448 available I/O pins for parallel interfaces or multiple serial lanes.
• Embedded Memory–Dependent Designs  Suitable for functions that need on-chip RAM resources, taking advantage of approximately 1.33 Mbits of embedded memory for buffering and local storage.

Unique Advantages

• High logic density: 24,192 logic elements enable implementation of complex digital functions without immediate need for external programmable devices.
• Substantial embedded memory: Approximately 1.33 Mbits of on-chip RAM reduces dependence on external memory for many buffering and data path tasks.
• Extensive I/O availability: 448 I/O pins support broad interfacing options and system-level integration.
• Compact BGA footprint: 676-FCBGA (27×27) surface-mount package helps maintain a small PCB area while delivering high integration.
• Commercial operating range and RoHS compliance: Clear specification for temperature and environmental compliance supports mainstream electronics manufacturing and deployment.

Why Choose XC4VLX25-10FFG676C?

The XC4VLX25-10FFG676C positions itself as a high-capacity Virtex-4 LX FPGA option with a balance of logic resources, embedded memory, and a large I/O complement in a compact 676-FCBGA package. Its defined supply voltage range and commercial temperature rating make it appropriate for mainstream electronic systems that require configurable logic and significant on-chip resources.

Manufactured by AMD, this FPGA is suitable for teams and projects that need a known FPGA resource set—24,192 logic elements, 448 I/O, and approximately 1.33 Mbits of embedded memory—packed into a surface-mount BGA package for streamlined board-level integration.

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