XC4VLX25-10FF668C

The XC4VLX25-10FF668C is a Virtex®-4 LX field programmable gate array (FPGA) manufactured by AMD, offered in a 668-ball FCBGA package. It provides mid-range programmable logic capacity with substantial I/O and on-chip memory tailored for compact, surface-mount board-level designs.

With 24,192 logic elements, approximately 1.33 Mbits of embedded memory and 448 user I/O, this device suits designs that require a balance of logic resources, embedded RAM and high I/O count while operating within a 1.14 V to 1.26 V supply range and a commercial temperature window.

Key Features

• Core Logic — 24,192 logic elements provide a mid-range programmable fabric for implementing custom digital functions and state machines.
• Embedded Memory — Approximately 1.33 Mbits of on-chip RAM for buffering, FIFOs and small data-store requirements without immediate external memory dependence.
• I/O Capacity — 448 user I/O pins to support broad peripheral interfacing, bus aggregation and multi-channel connectivity.
• Power — Operates from a supply range of 1.14 V to 1.26 V, enabling integration with regulated digital power rails.
• Package & Mounting — 668-FCBGA (27 × 27) package in a 668-BBGA, FCBGA footprint, designed for surface-mount PCB implementation.
• Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for alignment with common environmental requirements.

Typical Applications

• Mid-range programmable logic designs — Implement custom control logic, protocol handling and state machines where balanced logic capacity and I/O are required.
• I/O aggregation and interfacing — Use the high pin count to consolidate multiple signals or buses into a single programmable device for board-level signal management.
• On-chip buffering and data handling — Leverage the embedded RAM for temporary data storage, buffering and small FIFO implementations.

Unique Advantages

• Highly integrated logic and I/O: 24,192 logic elements and 448 I/O reduce the need for multiple discrete devices and simplify board-level partitioning.
• Embedded memory reduces external parts: Approximately 1.33 Mbits of on-chip RAM can lower BOM cost and board complexity by minimizing external memory requirements.
• Compact surface-mount package: The 668-FCBGA (27 × 27) package supports high-density layouts and space-constrained designs.
• Predictable power window: Narrow supply range (1.14 V–1.26 V) helps with power rail planning and stable operation within specified limits.
• RoHS compliant: Simplifies compliance with environmental regulations for commercial products.

Why Choose XC4VLX25-10FF668C?

The XC4VLX25-10FF668C positions itself as a balanced solution for designs that need a mid-level mix of logic resources, embedded memory and high I/O density in a compact surface-mount package. Its commercial-grade operating range and RoHS compliance make it suitable for mainstream electronic products requiring reliable programmable logic.

Designers and procurement teams seeking a field-programmable device that combines substantial on-chip RAM, a wide complement of I/O and a defined power and temperature window will find this Virtex-4 LX device appropriate for a range of board-level implementations where integration and predictable electrical characteristics are priorities.

Request a quote or submit your procurement requirements today to receive pricing and availability for the XC4VLX25-10FF668C.