XC4VLX200-10FF1513I

IC FPGA 960 I/O 1513FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 960 6193152 200448 1513-BBGA, FCBGA

Quantity 690 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1513-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1513-BBGA, FCBGANumber of I/O960Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs22272Number of Logic Elements/Cells200448
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6193152

Overview of XC4VLX200-10FF1513I – Virtex®-4 LX FPGA, 1513-FCBGA

The XC4VLX200-10FF1513I is a Virtex®-4 LX Field Programmable Gate Array (FPGA) in a 1513-FCBGA package designed for high-density programmable logic implementations. It provides a combination of large logic capacity, embedded RAM, and a high pin count to support complex digital designs.

With an industrial operating temperature range and RoHS compliance, this device is suited for designs that require robust operation across temperature extremes and regulatory compliance for lead-free manufacturing.

Key Features

  • Logic Capacity — 200,448 logic elements and 22,272 configurable logic blocks (CLBs) to implement large-scale digital logic and custom processing pipelines.
  • Embedded Memory — Approximately 6.19 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
  • High I/O Count — 960 I/O pins to connect to multiple peripherals, buses, and interfaces for system-level integration.
  • Power Supply Range — Core voltage operation from 1.14 V to 1.26 V to match system power domains and design constraints.
  • Package and Mounting — 1513-BBGA (1513-FCBGA, 40×40) surface-mount package that delivers a compact footprint for high-density board designs.
  • Temperature and Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Regulatory Compliance — RoHS compliant for lead-free manufacturing and assembly processes.

Typical Applications

  • High-density digital processing — Use the large logic element count for custom accelerators, protocol handling, and complex finite-state machines.
  • Memory-intensive functions — Leverage approximately 6.19 Mbits of embedded RAM for buffering, FIFOs, and on-chip data storage.
  • I/O-rich system integration — Utilize 960 I/O pins to interface with a wide range of sensors, peripherals, and external logic.
  • Industrial control systems — Industrial-grade temperature range supports deployment in factory automation and process-control environments.

Unique Advantages

  • Large programmable fabric: 200,448 logic elements and 22,272 CLBs provide capacity for substantial logic integration on a single device, reducing the need for multiple FPGAs.
  • Significant on-chip memory: Approximately 6.19 Mbits of embedded RAM minimizes reliance on external memory for many applications, simplifying board design.
  • Extensive I/O resources: 960 I/O pins enable broad system connectivity and flexible interfacing options.
  • Industrial operating range: Rated from −40 °C to 100 °C to meet temperature demands of industrial deployments.
  • Compact FCBGA packaging: 1513-FCBGA (40×40) allows high-pin-count functionality in a board-friendly surface-mount form factor.
  • RoHS compliant: Supports lead-free manufacturing processes and environmental regulatory requirements.

Why Choose XC4VLX200-10FF1513I?

The XC4VLX200-10FF1513I positions itself as a high-capacity Virtex®-4 LX FPGA option for designs that demand substantial logic density, significant embedded memory, and large I/O counts within a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it appropriate for robust, temperature-challenging implementations.

This device is a compelling choice for engineering teams building complex digital systems that require on-chip resources to reduce external BOM, simplify board layout, and maintain reliable operation across a wide temperature range.

Request a quote or submit a procurement inquiry to check pricing and availability for the XC4VLX200-10FF1513I and to begin your design integration process.

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