XC4VLX160-11FF1513I

IC FPGA 960 I/O 1513FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 960 5308416 152064 1513-BBGA, FCBGA

Quantity 230 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package1513-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1513-BBGA, FCBGANumber of I/O960Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs16896Number of Logic Elements/Cells152064
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5308416

Overview of XC4VLX160-11FF1513I – Virtex®-4 LX FPGA, 1513-FCBGA (40×40)

The XC4VLX160-11FF1513I is a Virtex®-4 LX Field Programmable Gate Array (FPGA) IC from AMD. It integrates 152,064 logic elements and approximately 5.3 Mbits of embedded memory with 960 user I/O pins, providing substantial on-chip resources for complex digital designs. The device is supplied in a 1513-BBGA (1513-FCBGA, 40×40) surface-mount package, operates from 1.14 V to 1.26 V, and is specified for an industrial operating temperature range of -40 °C to 100 °C. The part is RoHS compliant.

Key Features

  • Core Logic  Equipped with 152,064 logic elements to support large-scale programmable logic implementations.
  • Embedded Memory  Approximately 5.3 Mbits of on-chip RAM to store data and implement memory-intensive functions without external RAM.
  • I/O Capacity  960 user I/O pins to enable broad interfacing options with peripherals and system buses.
  • Package & Mounting  1513-BBGA (1513-FCBGA, 40×40) package in a surface-mount form factor for high-density board integration.
  • Power  Operates from a 1.14 V to 1.26 V supply range, suitable for designs requiring narrow core-voltage operation.
  • Temperature & Compliance  Industrial-grade device specified for -40 °C to 100 °C operation and RoHS compliant for regulatory compatibility.

Unique Advantages

  • High logic density: 152,064 logic elements provide the capacity to implement complex custom logic and parallel processing functions.
  • Significant embedded memory: Approximately 5.3 Mbits of on-chip RAM reduces reliance on external memory and helps simplify BOM and board layout.
  • Extensive I/O: 960 I/O pins allow direct connection to numerous peripherals, sensors, and high-pin-count interfaces.
  • Industrial temperature suitability: Rated -40 °C to 100 °C for deployment in demanding environmental conditions.
  • Compact FCBGA package: 1513-FCBGA (40×40) offers a space-efficient solution for high-density boards.
  • Regulatory compliance: RoHS compliant to meet environmental and manufacturing requirements.

Why Choose XC4VLX160-11FF1513I?

The XC4VLX160-11FF1513I positions itself for designs that require a substantial combination of logic density, embedded memory, and high I/O count within a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for applications that demand reliability across a wide thermal range.

Designers and procurement teams looking for a programmable device with a large logic fabric, ample on-chip RAM, and extensive interfacing capability will find this part suitable for complex digital systems where board space and thermal robustness are considerations.

Request a quote or submit an inquiry for XC4VLX160-11FF1513I with your required quantities and lead-time to begin procurement.

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