XC4VLX160-11FF1513I
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 960 5308416 152064 1513-BBGA, FCBGA |
|---|---|
| Quantity | 230 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1513-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1513-BBGA, FCBGA | Number of I/O | 960 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 16896 | Number of Logic Elements/Cells | 152064 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5308416 |
Overview of XC4VLX160-11FF1513I – Virtex®-4 LX FPGA, 1513-FCBGA (40×40)
The XC4VLX160-11FF1513I is a Virtex®-4 LX Field Programmable Gate Array (FPGA) IC from AMD. It integrates 152,064 logic elements and approximately 5.3 Mbits of embedded memory with 960 user I/O pins, providing substantial on-chip resources for complex digital designs. The device is supplied in a 1513-BBGA (1513-FCBGA, 40×40) surface-mount package, operates from 1.14 V to 1.26 V, and is specified for an industrial operating temperature range of -40 °C to 100 °C. The part is RoHS compliant.
Key Features
- Core Logic Equipped with 152,064 logic elements to support large-scale programmable logic implementations.
- Embedded Memory Approximately 5.3 Mbits of on-chip RAM to store data and implement memory-intensive functions without external RAM.
- I/O Capacity 960 user I/O pins to enable broad interfacing options with peripherals and system buses.
- Package & Mounting 1513-BBGA (1513-FCBGA, 40×40) package in a surface-mount form factor for high-density board integration.
- Power Operates from a 1.14 V to 1.26 V supply range, suitable for designs requiring narrow core-voltage operation.
- Temperature & Compliance Industrial-grade device specified for -40 °C to 100 °C operation and RoHS compliant for regulatory compatibility.
Unique Advantages
- High logic density: 152,064 logic elements provide the capacity to implement complex custom logic and parallel processing functions.
- Significant embedded memory: Approximately 5.3 Mbits of on-chip RAM reduces reliance on external memory and helps simplify BOM and board layout.
- Extensive I/O: 960 I/O pins allow direct connection to numerous peripherals, sensors, and high-pin-count interfaces.
- Industrial temperature suitability: Rated -40 °C to 100 °C for deployment in demanding environmental conditions.
- Compact FCBGA package: 1513-FCBGA (40×40) offers a space-efficient solution for high-density boards.
- Regulatory compliance: RoHS compliant to meet environmental and manufacturing requirements.
Why Choose XC4VLX160-11FF1513I?
The XC4VLX160-11FF1513I positions itself for designs that require a substantial combination of logic density, embedded memory, and high I/O count within a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for applications that demand reliability across a wide thermal range.
Designers and procurement teams looking for a programmable device with a large logic fabric, ample on-chip RAM, and extensive interfacing capability will find this part suitable for complex digital systems where board space and thermal robustness are considerations.
Request a quote or submit an inquiry for XC4VLX160-11FF1513I with your required quantities and lead-time to begin procurement.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








