XC4VLX160-10FFG1513I

The XC4VLX160-10FFG1513I is a Virtex®-4 LX Field Programmable Gate Array (FPGA) IC by AMD. It provides substantial on-chip integration with a high logic element count and significant embedded memory, packaged in a 1513-FCBGA surface-mount package and rated for industrial temperature operation.

Designed for applications that require large logic capacity, extensive I/O and reliable operation across a wide temperature range, this device targets industrial systems and other use cases where integration density and robust environmental tolerance are important.

Key Features

• Logic Capacity  Provides 152,064 logic elements to support complex, high-density digital designs.
• Embedded Memory  Includes approximately 5.31 Mbits of on-chip RAM for buffering, state storage and local data processing.
• I/O Count  Offers 960 user I/O pins to support wide external connectivity and parallel interfaces.
• Package & Mounting  1513-BBGA (1513-FCBGA, 40×40) FCBGA surface-mount package suitable for compact board-level integration.
• Power Supply  Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling predictable power planning for designs.
• Industrial Temperature Rating  Specified for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Environmental Compliance  RoHS compliant, supporting regulatory and sustainability considerations.

Typical Applications

• Industrial Control and Automation  High logic density and wide temperature range make the device suitable for control systems and automation equipment that require robust operation.
• High‑I/O Embedded Systems  Large I/O count supports designs that require many external interfaces, sensors, or parallel connections.
• Complex Digital Processing  Substantial logic elements and embedded RAM enable on-chip implementation of complex state machines and data paths.

Unique Advantages

• Large Integration Capacity: 152,064 logic elements enable consolidation of multiple functions into a single FPGA, reducing system BOM and board area.
• Significant On‑Chip Memory: Approximately 5.31 Mbits of embedded RAM support data buffering and local storage without external memory.
• Extensive External Connectivity: 960 I/O pins provide flexibility for interfacing with a wide range of peripherals and external devices.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
• Compact, Surface‑Mount FCBGA Package: 1513-FCBGA (40×40) package enables high-density board layouts and reliable soldered connections.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious designs.

Why Choose XC4VLX160-10FFG1513I?

The XC4VLX160-10FFG1513I combines high logic density, substantial on-chip memory and a large I/O count in a robust surface-mount FCBGA package. Its industrial temperature rating and controlled core voltage range make it well suited to designs that require reliable, integrated digital capability across challenging environments.

This FPGA is appropriate for engineers and procurement teams developing systems that prioritize integration density, extensive external interfacing and consistent operation under industrial conditions. Its specification set supports long-term deployment where design consolidation and environmental tolerance are key considerations.

Request a quote or submit your procurement inquiry today to check availability and pricing for XC4VLX160-10FFG1513I.