XC4VLX160-10FFG1148C

IC FPGA 768 I/O 1148FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 768 5308416 152064 1148-BBGA, FCBGA

Quantity 710 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package1148-FCPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1148-BBGA, FCBGANumber of I/O768Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs16896Number of Logic Elements/Cells152064
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5308416

Overview of XC4VLX160-10FFG1148C – Virtex®-4 LX FPGA, 152,064 logic elements, 768 I/Os

The XC4VLX160-10FFG1148C is a Virtex®-4 LX Field Programmable Gate Array (FPGA) IC from AMD. It combines extensive programmable logic capacity with substantial embedded memory and a high I/O count to address complex digital design requirements.

With 152,064 logic elements, approximately 5.3 Mbits of on-chip RAM and 768 I/Os in a 1148-ball FCBGA package, this device is intended for applications that require large logic integration, significant on-chip buffering, and dense external interfacing within commercial-temperature environments.

Key Features

  • Logic Capacity 152,064 logic elements provide extensive resources for implementing large-scale custom digital functions and parallel processing pipelines.
  • Embedded Memory Approximately 5.3 Mbits of on-chip RAM for buffering, packet storage, and other memory-intensive logic without immediate reliance on external memory.
  • I/O Resources 768 general-purpose I/Os support high pin-count connectivity for multi-channel interfaces and complex board-level integration.
  • Power Supply Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling integration with system power domains designed to these levels.
  • Package and Mounting 1148-BBGA (FCBGA) package with a 1148-FCPBGA supplier device package (35 × 35 mm); designed for surface-mount assembly.
  • Operating Conditions Commercial-grade device rated for 0 °C to 85 °C operation.
  • Environmental Compliance RoHS compliant to support environmental and regulatory requirements.

Typical Applications

  • Custom Digital Logic and Prototyping Large logic capacity enables implementation of complex, application-specific hardware accelerators and design prototyping.
  • High-Density Interface Bridging 768 I/Os accommodate multiple parallel interfaces and bus conversions on a single device, reducing board-level complexity.
  • On-Chip Buffering and Packet Processing Approximately 5.3 Mbits of embedded RAM supports buffering, queuing, and other memory-intensive functions within network and data-path designs.
  • Compact, High-Performance Board Designs The 1148-ball FCBGA package delivers a compact, surface-mount solution for space-constrained, high-pin-count applications.

Unique Advantages

  • Large on-chip logic resource: 152,064 logic elements allow consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
  • Substantial embedded memory: Approximately 5.3 Mbits of on-chip RAM decreases dependence on external memory and improves data-path latency.
  • High I/O density: 768 I/Os enable extensive peripheral and bus interfacing without multiple translator devices.
  • Compact FCBGA package: 1148-ball FCBGA (35 × 35 mm) supports high-density placement for complex systems in constrained form factors.
  • Commercial operating range: Rated for 0 °C to 85 °C, suitable for standard commercial deployments.
  • RoHS compliant: Meets common environmental compliance expectations for modern electronics manufacturing.

Why Choose XC4VLX160-10FFG1148C?

The XC4VLX160-10FFG1148C positions itself as a high-capacity Virtex-4 LX FPGA option for designers needing significant programmable logic, built-in memory, and extensive I/O in a single surface-mount package. Its combination of 152,064 logic elements, approximately 5.3 Mbits of on-chip RAM, and 768 I/Os supports integration of complex digital systems while reducing external component count.

This device is suitable for teams and projects focused on consolidating functions into programmable hardware within commercial temperature ranges, offering a scalable platform that aligns with OEM and integrator workflows while meeting RoHS environmental requirements.

Request a quote or submit a purchase inquiry today to evaluate the XC4VLX160-10FFG1148C for your next high-density FPGA design project.

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