XC4VLX160-10FF1513I
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 960 5308416 152064 1513-BBGA, FCBGA |
|---|---|
| Quantity | 317 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1513-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1513-BBGA, FCBGA | Number of I/O | 960 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 16896 | Number of Logic Elements/Cells | 152064 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5308416 |
Overview of XC4VLX160-10FF1513I – Virtex®-4 LX FPGA, 152,064 logic elements, 960 I/O
The XC4VLX160-10FF1513I is a Virtex®-4 LX Field Programmable Gate Array (FPGA) packaged in a 1513-ball FCBGA. It integrates a large logic fabric, substantial on‑chip memory and a high I/O count to support complex, high‑density digital designs.
With an industrial temperature grade and a tight core voltage range, this device is suited to applications that require high integration, deterministic supply requirements, and broad I/O connectivity.
Key Features
- Logic Capacity Provides 152,064 logic elements for implementing large, parallel digital designs and complex state machines.
- Embedded Memory Approximately 5.3 Mbits of embedded memory (5,308,416 total RAM bits) to support buffers, FIFOs, and data paths on chip.
- I/O Density Up to 960 user I/O pins to accommodate wide bus interfaces, multiple peripherals, or parallel data lanes.
- Package 1513‑ball BGA (1513‑FCBGA, supplier package 1513‑FCBGA 40×40) for high pin count and compact board-level integration.
- Power Supply Specified core voltage range of 1.14 V to 1.26 V for predictable power and timing behavior.
- Temperature & Mounting Industrial operating range of −40 °C to 100 °C and surface-mount package suitable for standard PCB assembly processes.
- Regulatory RoHS compliant.
Typical Applications
- High‑density digital systems Large logic capacity and on‑chip memory support complex control, protocol translation, and custom processing engines.
- Data acquisition and processing High I/O count and embedded RAM enable aggregation, buffering, and real‑time data path implementation.
- Industrial control and automation Industrial-grade temperature rating and robust packaging make it suitable for factory and process control applications.
- Interface consolidation Extensive I/O allows consolidation of multiple serial and parallel interfaces onto a single programmable device.
Unique Advantages
- High logic integration: 152,064 logic elements reduce the need for multiple discrete devices, simplifying system architecture.
- Substantial on‑chip memory: Approximately 5.3 Mbits of embedded RAM supports local buffering and memory‑intensive functions without external SRAM.
- Wide I/O capability: 960 I/O pins enable broad connectivity for multi‑lane interfaces and numerous peripherals.
- Industrial temperature range: Rated for −40 °C to 100 °C to meet the environmental demands of industrial deployments.
- Compact, high‑pin package: 1513‑FCBGA (40×40) provides a high pin count in a board‑efficient footprint for space‑constrained designs.
- Controlled core supply: Defined 1.14 V to 1.26 V supply window helps maintain stable performance and predictable power management.
Why Choose XC4VLX160-10FF1513I?
The XC4VLX160-10FF1513I positions itself as a high‑capacity, industrial‑grade FPGA offering extensive logic resources, embedded memory, and exceptional I/O density in a compact FCBGA package. Its defined core voltage range and broad operating temperature make it well suited to robust, long‑life designs that demand predictable electrical and thermal behavior.
This device is ideal for engineers building high‑integration systems that require on‑chip buffering, wide peripheral connectivity, and scalable logic resources—delivering long‑term value through consolidation of functions, reduced BOM, and a package designed for demanding board‑level integration.
Request a quote or submit a procurement inquiry to get pricing, availability, and ordering information for the XC4VLX160-10FF1513I.

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