XC4VLX15-12FFG668C

IC FPGA 320 I/O 668FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 320 884736 13824 668-BBGA, FCBGA

Quantity 21 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package668-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case668-BBGA, FCBGANumber of I/O320Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells13824
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits884736

Overview of XC4VLX15-12FFG668C – Virtex®-4 LX FPGA, 668‑FCBGA (Commercial)

The XC4VLX15-12FFG668C is a Virtex®-4 LX Field Programmable Gate Array (FPGA) from AMD. It delivers a balanced combination of programmable logic, on-chip memory, and I/O capacity in a 668-ball FCBGA package for surface-mount PCB integration.

Key on-chip resources include 1,536 CLBs (13,824 logic elements), approximately 0.885 Mbits of embedded memory, and up to 320 I/O pins. Electrical and environmental limits are defined by a core supply range of 1.14 V to 1.26 V and a commercial operating temperature range of 0 °C to 85 °C; the device is RoHS compliant.

Key Features

  • Core Architecture  Virtex‑4 LX family FPGA architecture in the XC4VLX15‑12FFG668C configuration.
  • Logic Capacity  1,536 CLBs providing 13,824 logic elements for implementing custom digital logic and state machines.
  • On‑Chip Memory  Approximately 0.885 Mbits of embedded RAM to support buffering, lookup tables, and small data stores.
  • High Pin Count I/O  320 I/O pins to support multiple external interfaces and parallel I/O requirements.
  • Power Supply  Core voltage supply specified from 1.14 V to 1.26 V to match system power budgeting and sequencing.
  • Package & Mounting  668‑ball FCBGA (27 × 27) package, surface‑mount mounting type, optimized for compact board layouts.
  • Commercial Grade & Temperature Range  Commercial grade device rated for operation from 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant for use in lead‑free manufacturing processes.

Unique Advantages

  • Significant programmable logic density: 1,536 CLBs and 13,824 logic elements enable complex logic implementation without external ASICs.
  • On‑chip memory capacity: Approximately 0.885 Mbits of embedded RAM reduces dependency on external memory for moderate buffering and lookup tasks.
  • Generous I/O count: 320 I/O pins allow support for parallel interfaces and multiple peripheral connections directly from the FPGA.
  • Compact FCBGA packaging: 668‑ball FCBGA (27 × 27) provides a high‑density integration option for space‑constrained boards.
  • Defined power and thermal limits: Clear supply voltage range (1.14 V–1.26 V) and commercial temperature rating simplify system design and validation.
  • RoHS compliance: Meets common lead‑free manufacturing and regulatory requirements.

Why Choose XC4VLX15-12FFG668C?

The XC4VLX15-12FFG668C delivers a practical mix of programmable logic, embedded memory, and I/O connectivity in a single commercial‑grade FPGA package. Its documented resource counts and electrical limits make it straightforward to evaluate for designs requiring moderate logic density and on‑chip RAM without resorting to external programmable devices.

This device suits teams and procurement cycles that need verifiable on‑chip resources, a high I/O footprint, and a compact FCBGA form factor. Supported design choices—such as core supply requirements and the commercial temperature range—help integrate the part into established PCB and power architectures while maintaining RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability information for the XC4VLX15-12FFG668C. Our team can assist with lead times and order placement.

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