XC4VLX15-11FFG668C
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 320 884736 13824 668-BBGA, FCBGA |
|---|---|
| Quantity | 968 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 668-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 668-BBGA, FCBGA | Number of I/O | 320 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 884736 |
Overview of XC4VLX15-11FFG668C – Virtex®-4 LX FPGA, 668-FCBGA, 320 I/O
The XC4VLX15-11FFG668C is a Virtex®-4 LX field programmable gate array (FPGA) from AMD, supplied in a 668-ball FCBGA package. It provides a balance of on-chip logic, embedded memory and I/O density for commercial temperature designs.
With 13,824 logic elements, 320 user I/O pins and approximately 0.885 Mbits of embedded memory, this device targets designs that require substantial programmable logic capacity and high interface count within a surface-mount FCBGA footprint.
Key Features
- Logic Capacity — 13,824 logic elements for implementing complex digital functions and custom hardware acceleration.
- Embedded Memory — Approximately 0.885 Mbits of on-chip RAM to support buffering, small data structures and embedded storage without external memory.
- I/O Density — 320 user I/O pins to enable wide parallel interfaces and multiple peripheral connections.
- Package & Mounting — 668-FCBGA (27 × 27) package, surface-mount mounting type for board-level integration in compact designs.
- Power — Core supply voltage range of 1.14 V to 1.26 V to match target power rails and system power budgeting.
- Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial deployments.
- Compliance — RoHS-compliant manufacturing status to meet common environmental and regulatory requirements.
Typical Applications
- High-density digital processing — Implement custom data-paths, state machines and accelerators using the 13,824 logic elements and embedded RAM.
- Multi-interface bridging — Use the 320 I/O pins to connect multiple parallel or serial interfaces and aggregate signals between subsystems.
- Prototyping and OEM modules — Integrate into commercial-temperature modules where surface-mount FCBGA packaging and mid-range FPGA resources are required.
Unique Advantages
- Balanced logic and memory — A combination of 13,824 logic elements and approximately 0.885 Mbits of embedded RAM supports both compute and storage needs on-chip, reducing reliance on external memory for many functions.
- High I/O capacity — 320 user I/Os enable broad connectivity for interfacing to sensors, peripherals and parallel buses without immediate need for expansion logic.
- Compact, board-ready package — The 668-FCBGA (27×27) surface-mount package simplifies integration into densely populated PCBs while maintaining signal density.
- Predictable power range — Core operation within a 1.14 V to 1.26 V window allows designers to plan power delivery and thermal considerations precisely.
- Commercial-grade suitability — Rated for 0 °C to 85 °C operation for standard commercial applications and deployments.
- RoHS compliance — Environmentally compliant manufacturing status for designs requiring lead-free components.
Why Choose XC4VLX15-11FFG668C?
The XC4VLX15-11FFG668C positions itself as a mid-range Virtex®-4 LX FPGA option that combines a substantial logic fabric, meaningful on-chip memory and a high I/O count in a 668-ball FCBGA package. It is well suited to commercial designs that need programmable logic density and connectivity without moving to larger package classes.
Designers and OEMs can leverage the device’s defined power and temperature envelopes along with RoHS compliance to build scalable, repeatable systems where on-chip resources reduce BOM complexity and integration effort.
Request a quote or submit an inquiry to obtain pricing, lead times and availability for the XC4VLX15-11FFG668C.

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